A high-performance lead-free solder – the effects of In on 99.3Sn/0.7Cu

Soldering & Surface Mount Technology

Volumn 13, Issue 2, 2001, Pages 7-13

  Hwang, Jennie S ^a   Guo, Zhenfeng ^a   Koenigsmann, Holger ^a  

^a H Technologies Group Inc   (United States)

Author keywords

Alloys; Lead free soldering; Melting

Indexed keywords

CREEP; FATIGUE OF MATERIALS; MELTING; PHASE TRANSITIONS; PRINTED CIRCUIT BOARDS; THERMAL EFFECTS; TIN ALLOYS; YIELD STRESS;

LEAD-FREE SOLDERS;

SOLDERING ALLOYS;

EID: 0034990736     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910110385194     Document Type: Article

References (2)

1. Hwang, J.S. (1996), Modern Solder Technology – Competitive Electronic Manufacturing, Chapter 15, McGraw-Hill, New York, NY.
2. United States Patent No. 5 985 212, High-Strength Lead-Free Solder Materials.