Effect of rapid solidification and small additions of Zn and Bi on the structure and properties of Sn-Cu eutectic alloy

Journal of Electronic Materials

Volumn 34, Issue 2, 2005, Pages 212-215

  El Ashram, Taker ^a   Shalaby, R M ^b  

^a Port Said University   (Egypt)

^b Mansoura University   (Egypt)

Author keywords

Creep; Differential thermal analysis (DTA); Microhardness; Rapid solidification; Resistivity; Solder

Indexed keywords

COPPER; CREEP; DIFFERENTIAL THERMAL ANALYSIS; EUTECTICS; MELT SPINNING; MICROHARDNESS; QUENCHING; RAPID SOLIDIFICATION; X RAY DIFFRACTION; ZINC;

CREEP RESISTANCE; LINEAR SPEEDS; SHIMADZU X-RAY DIFFRACTOMETERS; VICKERS MICROHARDNESS;

TIN ALLOYS;

EID: 14644415469     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0234-y     Document Type: Article

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