Effect of Ni on the formation of Cu6Sn5 and Cu3 intermetallics

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 30, Issue 4, 2007, Pages 293-298

  Yu, Hao ^a   Vuorinen, Vesa ^a   Kivilahti, Jorma ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

Cu3Sn; Cu6Sn5; Intermetallics; Lead free solder; Solder substrate interfacial reaction

Indexed keywords

COPPER ALLOYS; DISSOLUTION; NICKEL; SURFACE CHEMISTRY; THERMODYNAMICS; TIN ALLOYS;

COMPONENT ATOMS; DIFFUSION FLUX; LEAD-FREE SOLDER; THERMODYNAMIC ASSESSMENT;

INTERMETALLICS;

EID: 35348922917     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2007.906495     Document Type: Article

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