Recent thermal management techniques for microprocessors

ACM Computing Surveys

Volumn 44, Issue 3, 2012, Pages

  Kong, Joonho ^a   Chung, Sung Woo ^a   Skadron, Kevin ^b  

^a Korea University   (South Korea)

^b University of Virginia   (United States)

Author keywords

Microprocessor; Performance and reliability; Thermal management

Indexed keywords

AIR COOLING; CONTROL HARDWARES; DYNAMIC RELIABILITY MANAGEMENTS; DYNAMIC THERMAL MANAGEMENT; FLOOR-PLANNING; INSTRUCTION SCHEDULING; LIQUID COOLING; MALICIOUS CODES; MANAGEMENT TECHNIQUES; MICROPROCESSOR DESIGNS; PROCESS TECHNOLOGIES; RELIABILITY MODELING; SCALE-UP; SENSOR PLACEMENT; STATIC AND DYNAMIC; TASK-SCHEDULING; TEMPERATURE DEPENDENT; TEMPERATURE ESTIMATION; TEMPERATURE MONITORING; THERMAL RELIABILITY; TRANSISTOR DENSITY;

COOLING; INDUSTRIAL MANAGEMENT; LIQUIDS; MICROPROCESSOR CHIPS; RELIABILITY; TEMPERATURE MEASUREMENT;

TEMPERATURE CONTROL;

EID: 84863832368     PISSN: 03600300     EISSN: 15577341     Source Type: Journal    
DOI: 10.1145/2187671.2187675     Document Type: Article

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