Fast, automated thermal simulation of three-dimensional integrated circuits

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2004, Pages 706-713

  Wilkerson, Patrick ^a   Raman, Ashok ^a   Turowski, Marek ^a  

^a CFD RESEARCH CORPORATION   (United States)

Author keywords

3D IC stack; Automated 3D modeling; Compact models; Localized heating; Reduced thermal models; Scripting; Simulations; SPICE netlist; Thermal vias

Indexed keywords

3D IC STACK; COMPACT MODELS; LOCALIZED HEATING; REDUCED THERMAL MODELS; SPICE NETLIST; THERMAL VIAS;

COMPUTER SIMULATION; DIELECTRIC MATERIALS; HEAT LOSSES; HEAT RESISTANCE; LOGIC DESIGN; MICROPROCESSOR CHIPS; NUMERICAL ANALYSIS; OPTOELECTRONIC DEVICES; PERMITTIVITY; SIGNAL PROCESSING; THERMAL CONDUCTIVITY; THERMOANALYSIS;

INTEGRATED CIRCUITS;

EID: 4444336986     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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