Exploiting application-dependent ambient temperature for accurate architectural simulation

Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors

Volumn , Issue , 2010, Pages 502-508

  Jang, Hyung Beom ^a   Choi, Jinhang ^a   Yoon, Ikroh ^b   Lim, Sung Soo ^c   Shin, Seungwon ^b   Chang, Naehyuck ^d   Chung, Sung Woo ^a  

^a Korea University   (South Korea)

^b Hong Ik University   (South Korea)

^c Kookmin University   (South Korea)

^d Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AMBIENT TEMPERATURES; ARCHITECTURAL SIMULATION; DYNAMIC THERMAL MANAGEMENT; EVALUATION RESULTS; FIXED TEMPERATURE; HIGH TEMPERATURE; PROCESSOR DESIGN; STEADY STATE; THERMAL SIMULATIONS;

DESIGN; TEMPERATURE;

TEMPERATURE CONTROL;

EID: 78650736086     PISSN: 10636404     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICCD.2010.5647639     Document Type: Conference Paper

References (27)

1. W. L. Bircher and L. K. John, "Complete System Power Estimation: A Trickle-Down Approach Based on Performance Events, " in Proc. Int'l Symp. Performance Analysis of Systems & Software, pp. 158-168, Apr. 2007.
2. D. Brooks and M. Martonosi, "Dynamic Thermal Management for High-Performance Microprocessors, " in Proc. 7th Int'l Symp. High-Performance Computer Architecture, pp. 171-82, Jan. 2001.
3. J. Choi, Y. Kim, A. Sivasubramanaiam, J. Srebric, Q. Wang, and J. Lee, "Modeling and Managing Thermal Profiles of Rack-mounted Servers with ThermoStat, " in Proc. 13th Annu. Int'l Symp. High-Performance Computer Architecture, pp. 205-215, Feb. 2007.
4. J. Donald and M. Martonosi, "Techniques for Multicore Thermal Management: Classification and New Exploration, " ACM SIGARCH Computer Architecture News, pp. 78-88, May 2006.
5. S. Eranian, "What can performance counters do for memory subsystem analysis?" in Proc. ACM SIGPLAN workshop on Memory Systems Performance and Correctness, pp. 26-30, Mar. 2008.
6. M. S. Floyd, S. Ghiasi, T. W. Keller, K. Rajamani, F. L. Rawson, J. C. Rubio, and M. S. Ware, "System Power Management Support in the IBM POWER6 Microprocessor, " IBM Journal of Research and Development, Vol. 51, pp. 733-746, Nov. 2007.
7. J. Gim, Y. Won, J. Chang, J. Shim, and Y. Park, "DIG: Rapid Characterization of Modern Hard Disk Drive and its performance implication, " in Proc. 5th IEEE Int'l Workshop on Storage Network Architecture and Parallel I/Os, pp. 74-83, Sep. 2008.
8. S. H. Gunther, F. Binns, D. M. Carmean, and J. C. Hall, "Managing the Impact of Increasing Microprocessor Power Consumption, " Intel Tech. Journal, Vol. Q1, 2001.
9. H. Hanson, S. W. Keckler, S. Ghiasi, K. Rajamani, F. Rawson, and J. Rubio, "Thermal response to DVFS: analysis with an Intel Pentium M, " in Proc. Int'l Symp. Low Power Electronics and Design, pp. 219-224, Aug. 2007.
10. T. Heath, A. P. Centeno, P. George, L. Ramos, Y. Jaluria, and R. Bianchini, "Mercury and Freon: Temperature Emulation and Management for Server Systems, " in Proc. Int'l Conf. Architectural Support for Programming Languages and Operating Systems, pp. 106-116, Oct. 2006.
11. C. Isci, and M. Martonosi, "Runtime Power Monitoring in High-End Processors: Methodology and Empirical Data, " in Proc. 36th Annual Int'l Symp. Microarchitecture, pp. 93-104, Dec. 2003.
12. J. Kong, J. John, E.-Y. Chung, S. W. Chung, and J. Hu, "On the Thermal Attack in Instruction Caches, " IEEE Trans. on Dependable and Secure Computing, Vol. 7, pp. 217-223, Apr. 2010.
13. A. Kumar, L. Shang, L.-S. Peh, and N. K. Jha, "HybDTM: a coordinated hardware-software approach for dynamic thermal management, " in Proc. 43rd Annu. Conf. Design Automation, pp. 548-553, Jul. 2006.
14. Y. Kim, S. Gurumurthi, and A. Sivasubramaniam, "Understanding the Performance-Temperature Interactions in Disk I/O of Server Workloads, " in Proc. 20th Int'l Symp. High-Performance Computer Architecture, pp. 176-186, Feb. 2006.
15. J. S. Lee, K. Skadron, and S. W. Chung, "Predictive Temperature- Aware DVFS, " IEEE Trans. Computers, Vol. 59, pp. 127-133, Jan. 2010.
16. K.-J. Lee and K. Skadron, "Using Performance Counters for Runtime Temperature Sensing in High-Performance Processors, " in Proc. 19th Annu. Int'l Parallel and Distributed Processing Symp. -Workshop 11-, Vol. 12, pp. 232.1, Apr. 2005.
17. S. Liu, S. O. Memik, Y. Zhang, and G. Memik, "An Approach for Adaptive DRAM Temperature and Power Management, " in Proc. 22nd Annu. Int'l Conf. Supercomputing, pp. 63-72, Jun. 2008.
18. G. H. Loh, "A modular 3d processor for flexible product design and technology migration, " in Proc. Conf. Computing Frontiers, pp. 159-170, May 2008.
19. F. J. Mesa-Martinez, E. K. Ardestani, and J. Renau, "Characterizing Processor Thermal Behavior, " in Proc. 15th Architectural Support for Programming Languages and Operating Systems, pp. 193-204, Mar. 2010.
20. K. Skadron, M. R. Stan, W. Huang, S. Velusamy, K. Sankaranarayanan, and D. Tarjan, "Temperature-Aware Microarchitecture, " in Proc. 30th Annu. Int'l Symp. Computer Architecture, pp. 2-13, Jun. 2003.
21. W. Wu, L. Jin, J. Yang, P. Liu, and S. X. -D. Tan, "Efficient Power Modeling and Software Thermal Sensing for Runtime Temperature Monitoring, " ACM Trans. on Design Automation of Electronics Systems, Vol. 12, pp. 1-29, Aug. 2007.
22. Koolance, Flat Thermal Sensor SEN-AP002P Available: http://www.koolance. com/water-cooling/product-info.php?product-id=194.
23. Hitachi Travelstar 5K320 Hard Disk Drive Specification, Hitachi Corporation, Apr. 2008.
24. ™2 Extreme Mobile Processor on 45-nm Process Datasheet, Intel Corporation, Mar. 2009.
25. SPEC, Standard Performance Evaluation Corporation. Available: http://www.spec.org/cpu2000/.
26. Micron, System-Power Calculator. Available: http://www.micron.com/ support/part-info/powercalc.
27. User's guide, Icepak, 4.4.6. ANSYS/Fluent Inc., Lebanon, NH, 2007.