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Volumn , Issue , 2008, Pages 468-473

A stochastic local hot spot alerting technique

Author keywords

[No Author keywords available]

Indexed keywords

CHALLENGING TASK; CHIP TEMPERATURE; DECISION PROCESS; DESIGN AUTOMATION CONFERENCE; HOT SPOTTING; JUNCTION TEMPERATURES; KALMAN FILTERING; LOCAL HOT SPOT; MARKOVIAN; NANO-SCALE DEVICES; PAPER ADDRESSES; POWER DENSITIES; SOUTH PACIFIC; STOCHASTIC FRAMEWORK; THERMAL MANAGEMENT; TIMELY IDENTIFICATION;

EID: 49549121056     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASPDAC.2008.4483996     Document Type: Conference Paper
Times cited : (13)

References (18)
  • 1
    • 33947207004 scopus 로고    scopus 로고
    • Thermal Modeling, Analysis and Management in VLSI Circuits: Principles and Methods
    • Aug
    • M. Pedram, and S. Nazarian, "Thermal Modeling, Analysis and Management in VLSI Circuits: Principles and Methods," Proc. of IEEE, Vol. 95, No. 8, Aug., 2006.
    • (2006) Proc. of IEEE , vol.95 , Issue.8
    • Pedram, M.1    Nazarian, S.2
  • 5
    • 34548119036 scopus 로고    scopus 로고
    • Power and Thermal Management in Intel Core Duo Processor
    • May
    • A. Naveh, et al., "Power and Thermal Management in Intel Core Duo Processor," Intel Technology Journal, Vol. 10, Issue 2, May, 2006.
    • (2006) Intel Technology Journal , vol.10 , Issue.2
    • Naveh, A.1
  • 8
    • 27844435067 scopus 로고    scopus 로고
    • Inverse Heat Conduction Problems in Electronics with Special Considerations of Analytical Analysis Methods
    • Oct
    • M. Janicki, and A. Napieralski, "Inverse Heat Conduction Problems in Electronics with Special Considerations of Analytical Analysis Methods," Proc. of Int'l Semiconductor, Vol. 2, Issue 4, Oct., 2004.
    • (2004) Proc. of Int'l Semiconductor , vol.2 , Issue.4
    • Janicki, M.1    Napieralski, A.2
  • 10
    • 85024429815 scopus 로고
    • A New Approach to Linear Filtering and Prediction Problem
    • Series D
    • R. E. Kalman, "A New Approach to Linear Filtering and Prediction Problem," Journal of Basic Engineering, Vol. 82, Series D, 1960.
    • (1960) Journal of Basic Engineering , vol.82
    • Kalman, R.E.1
  • 12
    • 49549093074 scopus 로고    scopus 로고
    • JEDEC standards
    • JEDEC standards. http://www.jedec.org.
  • 16
    • 0038379168 scopus 로고    scopus 로고
    • 3D Thermal-ADI: An Efficient Chip-Level Transient Thermal Simulator
    • Apr
    • T. Wang, Y. Lee, and C. C. Chen, "3D Thermal-ADI: An Efficient Chip-Level Transient Thermal Simulator," Proc. of ISPD, Apr., 2003.
    • (2003) Proc. of ISPD
    • Wang, T.1    Lee, Y.2    Chen, C.C.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.