Statistical thermal profile considering process variations: Analysis and applications

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Volumn 27, Issue 6, 2008, Pages 1027-1040

  Jaffari, Javid ^a,b   Anis, Mohab ^a,b  

^a IEEE

^b UNIVERSITY OF WATERLOO   (Canada)

Author keywords

Leakage power; Power modeling and estimation; Spatial correlation; Statistical; Thermal analysis

Indexed keywords

MONTE CARLO METHODS; OXIDES; PRODUCT DESIGN; THERMAL EFFECTS;

LEAKAGE POWER; SPATIAL CORRELATION; STATISTICAL THERMAL PROFILE;

ELECTRIC POWER UTILIZATION;

EID: 44149087899     PISSN: 02780070     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAD.2008.923251     Document Type: Article

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