A novel thermal optimization flow using incremental floor planning for 3D ICs

Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Volumn , Issue , 2009, Pages 347-352

  Li, Xin ^a   Yuchun, Ma ^a   Hong, Xianlong ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

3-D ICS; 3D IC DESIGNS; CRITICAL CHALLENGES; FLOOR-PLANNING; FLOORPLAN; HOT BLOCKS; HOT SPOTS; INCREMENTAL CHANGES; MIXED INTEGER LINEAR PROGRAMMING MODELS; MULTIPLE OBJECTIVES; ON-CHIP TEMPERATURES; RUN-TIME; THERMAL OPTIMIZATIONS; WIRE LENGTHS;

COMPUTER AIDED DESIGN; DIGITAL INTEGRATED CIRCUITS; EMBEDDED SYSTEMS; LINEAR PROGRAMMING; LINEARIZATION; OPTIMIZATION; THREE DIMENSIONAL;

INTEGER PROGRAMMING;

EID: 64549085333     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASPDAC.2009.4796505     Document Type: Conference Paper

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