On the thermal attack in instruction caches

IEEE Transactions on Dependable and Secure Computing

Volumn 7, Issue 2, 2010, Pages 217-223

  Kong, Joonho ^a   John, Johnsy K ^b   Chung, Eui Young ^c   Chung, Sung Woo ^a   Hu, Jie ^d  

^a Korea University   (South Korea)

^b ADVANCED MICRO DEVICES   (United States)

^c Yonsei University   (South Korea)

^d NEW JERSEY INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Cache memories; Fine grain localized hotspot; Malicious codes; Microprocessors; Thermal attack

Indexed keywords

EMPIRICAL DESIGN; HEAT-UP; HOT SPOT; HOTSPOTS; INSTRUCTION CACHES; MALICIOUS CODES; MICROPROCESSORS; ON CHIPS; PHYSICAL DAMAGES; THERMAL ATTACK; THERMAL MANAGEMENT; THERMAL SENSORS;

MICROPROCESSOR CHIPS;

CACHE MEMORY;

EID: 77952697108     PISSN: 15455971     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDSC.2009.16     Document Type: Article

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