Thermal management for 3D processors via task scheduling

Proceedings of the International Conference on Parallel Processing

Volumn , Issue , 2008, Pages 115-122

  Zhou, Xiuyi ^a   Xu, Yi ^a   Du, Yu ^b   Zhang, Youtao ^b   Yang, Jun ^a  

^a University of Pittsburgh   (United States)

^b UNIVERSITY OF PITTSBURGH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3D INTEGRATION TECHNOLOGIES; 3D PROCESSORS; 3D TECHNOLOGIES; CHIP PERFORMANCES; CHIP TEMPERATURES; DEVICE DENSITIES; HEAT DISSIPATIONS; HIGH TEMPERATURES; IN CHIPS; INTER-CONNECTS; LIFE-TIMES; PERFORMANCE IMPROVEMENTS; POWER DENSITIES; SPEED INTERFACES; TASK SCHEDULING; THERMAL MANAGEMENTS; TRIGGER VOLTAGES;

DIES; INTEGRATION; MULTITASKING; SCHEDULING ALGORITHMS;

SCHEDULING;

EID: 55949114476     PISSN: 01903918     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICPP.2008.51     Document Type: Conference Paper

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