Dynamic thermal management in 3D multicore architectures

Proceedings -Design, Automation and Test in Europe, DATE

Volumn , Issue , 2009, Pages 1410-1415

  Coskun, Ayse K ^a   Ayala, José L ^b   Atienza, David ^c   Rosing, Tajana Simunic ^a   Leblebici, Yusuf ^c  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b UNIVERSIDAD COMPLUTENSE DE MADRID   (Spain)

^c EPFL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ENERGY POLICY; ENERGY UTILIZATION; INTEGRATED CIRCUIT INTERCONNECTS; MEMORY ARCHITECTURE; POWER MANAGEMENT; SCHEDULING; SOFTWARE ARCHITECTURE; TEMPERATURE CONTROL; THREE DIMENSIONAL INTEGRATED CIRCUITS;

COMPUTATIONAL UNITS; DYNAMIC THERMAL MANAGEMENT; HIGH POWER DENSITY; JOB SCHEDULING POLICIES; LARGE TEMPERATURE VARIATIONS; MULTICORE ARCHITECTURES; REDUCE ENERGY CONSUMPTION; TECHNOLOGY SCALING;

THERMAL MANAGEMENT (ELECTRONICS);

EID: 70350055176     PISSN: 15301591     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/date.2009.5090885     Document Type: Conference Paper

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