Three-dimensional multiprocessor system-on-chip thermal optimization

CODES+ISSS 2007: International Conference on Hardware/Software Codesign and System Synthesis

Volumn , Issue , 2007, Pages 117-122

  Sun, Chong ^a   Shang, Li ^a   Dick, Robert P ^b  

^a QUEEN S UNIVERSITY   (Canada)

^b NORTHWESTERN UNIVERSITY   (United States)

Author keywords

3D; Multiprocessor system on chip; Synthesis; Thermal

Indexed keywords

MICROPROCESSOR CHIPS; MULTIPROGRAMMING; OPTIMIZATION; RELIABILITY ANALYSIS; THERMAL EFFECTS;

MULTIPROCESSOR SYSTEM-ON-CHIP; MULTITHREADED BENCHMARKS; THERMAL HETEROGENEITY;

MULTIPROCESSING SYSTEMS;

EID: 38849163462     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/1289816.1289846     Document Type: Conference Paper

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