-
5
-
-
23044522692
-
Comparison of Cl2 and F-based dry etching for high aspect ratio Si microstructures etched with an inductively coupled plasma source
-
Tian W.-C., Weigold J.W., Pang S.W. Comparison of Cl2 and F-based dry etching for high aspect ratio Si microstructures etched with an inductively coupled plasma source. J. Vac. Sci. Technol. B 2000, 18:1890.
-
(2000)
J. Vac. Sci. Technol. B
, vol.18
, pp. 1890
-
-
Tian, W.-C.1
Weigold, J.W.2
Pang, S.W.3
-
6
-
-
0006606314
-
Reactive Ion Etching: Handbook of Plasma Processing Technology
-
Noyes, Park Ridge, NJ
-
G.S. Oehrlein, S. M. Rossnagel (Ed.), Reactive Ion Etching: Handbook of Plasma Processing Technology, Noyes, Park Ridge, NJ, 1990, 196.
-
(1990)
, pp. 196
-
-
Oehrlein, G.S.1
Rossnagel, S.M.2
-
7
-
-
0017994895
-
Plasma etching of Si and SiO2: the effect of oxygen addition to CF4-plasmas
-
Mogab C.J., Adams A.C., Flamm D.L. Plasma etching of Si and SiO2: the effect of oxygen addition to CF4-plasmas. J. Appl. Phys. 1979, 49:3796-3803.
-
(1979)
J. Appl. Phys.
, vol.49
, pp. 3796-3803
-
-
Mogab, C.J.1
Adams, A.C.2
Flamm, D.L.3
-
8
-
-
0029546528
-
Gas-phase silicon micromachining with xenon difluoride
-
Chang F.I., Yeh R., Lin G., Chu P.B., Hoffman E., Kruglick E.J., Pister K.S.J., Hecht M.H. Gas-phase silicon micromachining with xenon difluoride. Proc. SPIE Microelectronic Structures and Microelectromechanical Devices for Optical Processing and Multimedia Applications 1995, 2641:117-128.
-
(1995)
Proc. SPIE Microelectronic Structures and Microelectromechanical Devices for Optical Processing and Multimedia Applications
, vol.2641
, pp. 117-128
-
-
Chang, F.I.1
Yeh, R.2
Lin, G.3
Chu, P.B.4
Hoffman, E.5
Kruglick, E.J.6
Pister, K.S.J.7
Hecht, M.H.8
-
9
-
-
0021517388
-
Plasmaless dry etching of silicon with fluorine-containing compounds
-
Flamm D.L. Plasmaless dry etching of silicon with fluorine-containing compounds. J. Appl. Phys. 1984, 56:2939-2942.
-
(1984)
J. Appl. Phys.
, vol.56
, pp. 2939-2942
-
-
Flamm, D.L.1
-
10
-
-
36249021917
-
A novel sacrificial layer technology based on highly selective etching of silicon-germanium in ClF3
-
C. Leinenbach, H. Seidel, T. Fuchs, S. Kronmueller, F. Laermer, A novel sacrificial layer technology based on highly selective etching of silicon-germanium in ClF3, in: Proc. IEEE MEMS 2007, Kobe (JP), 2007, 65-68.
-
(2007)
Proc. IEEE MEMS 2007, Kobe (JP)
, pp. 65-68
-
-
Leinenbach, C.1
Seidel, H.2
Fuchs, T.3
Kronmueller, S.4
Laermer, F.5
-
11
-
-
0036353662
-
Characteristics of plasmaless dry etching of silicon-related materials using chlorine-trifluoride gas
-
Saito Y. Characteristics of plasmaless dry etching of silicon-related materials using chlorine-trifluoride gas. Sensors Mat. 2002, 14(5):231-237.
-
(2002)
Sensors Mat.
, vol.14
, Issue.5
, pp. 231-237
-
-
Saito, Y.1
-
12
-
-
0030675939
-
Gas-phase silicon etching with bromine trifluoride
-
Wang X.-Q., Xang X., Walsh K., Tai Y.-C. Gas-phase silicon etching with bromine trifluoride. Proc. Transducers,'97 1997, 2:1505-1508.
-
(1997)
Proc. Transducers,'97
, vol.2
, pp. 1505-1508
-
-
Wang, X.-Q.1
Xang, X.2
Walsh, K.3
Tai, Y.-C.4
-
13
-
-
51649101854
-
Cyclic deep reactive ion etching with mask replenishment
-
Adam T.N., et al. Cyclic deep reactive ion etching with mask replenishment. J. Micromech. Microeng. 2007, 17:1773-1780.
-
(2007)
J. Micromech. Microeng.
, vol.17
, pp. 1773-1780
-
-
Adam, T.N.1
-
14
-
-
0037683086
-
Challenges, developments and applications of deep silicon reactive ion etching
-
Laermer F., Urban A. Challenges, developments and applications of deep silicon reactive ion etching. Microelec. Engin. 2003, 67-68:349.
-
(2003)
Microelec. Engin.
, vol.67-68
, pp. 349
-
-
Laermer, F.1
Urban, A.2
-
15
-
-
0033891780
-
Micromachining of buried micro channels in silicon
-
de Boer M.J., et al. Micromachining of buried micro channels in silicon. J. Microelectromech. Syst. 2000, 9:94.
-
(2000)
J. Microelectromech. Syst.
, vol.9
, pp. 94
-
-
de Boer, M.J.1
-
16
-
-
0034850698
-
Comparison of Bosch and cryogenic processes for patterning high aspect ratio features in silicon
-
Walker M.J. Comparison of Bosch and cryogenic processes for patterning high aspect ratio features in silicon. Proc. of SPIE 2001, 4407:89-99.
-
(2001)
Proc. of SPIE
, vol.4407
, pp. 89-99
-
-
Walker, M.J.1
-
17
-
-
0003950677
-
Method for anisotropically etching silicon
-
German Patent DE-4241045, US Patent 5,501,893
-
F. Laermer, A. Schilp, Method for anisotropically etching silicon, German Patent DE-4241045, US Patent 5,501,893.
-
-
-
Laermer, F.1
Schilp, A.2
-
19
-
-
0029489901
-
Silicon fusion bonding and deep reactive ion etching: a new technology for microstructures
-
Stockholm, Sweden, June
-
E.H. Klaassen, K. Petersen, J.M. Noworolski, J. Logan, N.I. Maluf, J. Brown, C. Storment, W. McCulley, G.T.A. Kovacs, Silicon fusion bonding and deep reactive ion etching: a new technology for microstructures, in: Proc. Transducers 1995, Stockholm, Sweden, June 1995, 556-559.
-
(1995)
Proc. Transducers 1995
, pp. 556-559
-
-
Klaassen, E.H.1
Petersen, K.2
Noworolski, J.M.3
Logan, J.4
Maluf, N.I.5
Brown, J.6
Storment, C.7
McCulley, W.8
Kovacs, G.T.A.9
-
20
-
-
36549100931
-
Low-temperature reactive ion etching and microwave plasma etching of silicon
-
Tachi S., Kazunori K., Okudaira S. Low-temperature reactive ion etching and microwave plasma etching of silicon. Appl. Phys. Lett. 1988, 52(8):616-618.
-
(1988)
Appl. Phys. Lett.
, vol.52
, Issue.8
, pp. 616-618
-
-
Tachi, S.1
Kazunori, K.2
Okudaira, S.3
-
24
-
-
10744229608
-
2 etching process
-
2 etching process. J. Micromechan. Microengin. 2004, 14:190-196.
-
(2004)
J. Micromechan. Microengin.
, vol.14
, pp. 190-196
-
-
Dussart, R.1
Boufnichel, M.2
Marcos, G.3
Lefaucheux, P.4
Basillais, A.5
Benoit, R.6
Tillocher, T.7
Mellhaoui, X.8
Estrade-Szwarckopf, H.9
Ranson, P.10
-
25
-
-
28644448956
-
y passivation layer in silicon cryoetching
-
104901-1-104901-10
-
y passivation layer in silicon cryoetching. J. Appl. Phys. 2005, 98(10):104901-1-104901-10.
-
(2005)
J. Appl. Phys.
, vol.98
, Issue.10
-
-
Mellhaoui, X.1
Dussart, R.2
Tillocher, T.3
Lefaucheux, P.4
Ranson, P.5
Boufnichel, M.6
Overzet, L.J.7
-
26
-
-
34249895267
-
Mask material effects in cryogenic deep reactive ion etching
-
Sainiemi L., Franssila S. Mask material effects in cryogenic deep reactive ion etching. J. Vac. Sci. Technol. B 2007, 25:801-807.
-
(2007)
J. Vac. Sci. Technol. B
, vol.25
, pp. 801-807
-
-
Sainiemi, L.1
Franssila, S.2
-
27
-
-
78649769826
-
Deep anisotropic etching of silicon
-
Aachboun S., Ranson P. Deep anisotropic etching of silicon. J. Vac. Sci. Tech. B 1999, 17:2270-2273.
-
(1999)
J. Vac. Sci. Tech. B
, vol.17
, pp. 2270-2273
-
-
Aachboun, S.1
Ranson, P.2
-
28
-
-
33744461560
-
Deep reactive ion etching of borosilicate glass using an anodically bonded silicon wafer as an etch mask
-
Akashi T., Yoshimura Y. Deep reactive ion etching of borosilicate glass using an anodically bonded silicon wafer as an etch mask. J. Micromech. Microeng. 2006, 16:1051.
-
(2006)
J. Micromech. Microeng.
, vol.16
, pp. 1051
-
-
Akashi, T.1
Yoshimura, Y.2
-
31
-
-
0036906239
-
Fabrication of high-density electrical feed-throughs by deep-reactive-ion etching of Pyrex glass
-
Li X., Abe T., Liu Y., Esashi M. Fabrication of high-density electrical feed-throughs by deep-reactive-ion etching of Pyrex glass. J. Microelectromech. Syst. 2002, 11:625.
-
(2002)
J. Microelectromech. Syst.
, vol.11
, pp. 625
-
-
Li, X.1
Abe, T.2
Liu, Y.3
Esashi, M.4
-
32
-
-
25444466973
-
6/Ar inductively coupled plasmas
-
6/Ar inductively coupled plasmas. Microelec. Eng. 2005, 82:119.
-
(2005)
Microelec. Eng.
, vol.82
, pp. 119
-
-
Park, J.H.1
-
34
-
-
0032138693
-
Etching materials with an atmospheric-pressure plasma jet
-
Jeong J.Y., et al. Etching materials with an atmospheric-pressure plasma jet. Plasma sources science and technology 1998, 7:282-285.
-
(1998)
Plasma sources science and technology
, vol.7
, pp. 282-285
-
-
Jeong, J.Y.1
-
35
-
-
0034324286
-
Powder blasting for three-dimensional microstructuring of glass
-
Belloy E., et al. Powder blasting for three-dimensional microstructuring of glass. Sens. Actuators A 2000, 86:231-237.
-
(2000)
Sens. Actuators A
, vol.86
, pp. 231-237
-
-
Belloy, E.1
-
36
-
-
0005440235
-
Focused-ion-beam "cutter" and "attacher" for micromachining and device transplantation
-
Ishitani T., et al. Focused-ion-beam "cutter" and "attacher" for micromachining and device transplantation. J. Vacuum Sci. Tech. B 1991, 9(5):2633-2637.
-
(1991)
J. Vacuum Sci. Tech. B
, vol.9
, Issue.5
, pp. 2633-2637
-
-
Ishitani, T.1
-
37
-
-
0032339796
-
Influence of reactor wall conditions on etch processes in inductively coupled fluorocarbon plasmas
-
Schaepkens M., Bosch R.C.M., Standaert T.E.F.M., Oehrlein G.S., Cook J.M. Influence of reactor wall conditions on etch processes in inductively coupled fluorocarbon plasmas. J. Vac. Sci. Technol. A 1998, 16:2099.
-
(1998)
J. Vac. Sci. Technol. A
, vol.16
, pp. 2099
-
-
Schaepkens, M.1
Bosch, R.C.M.2
Standaert, T.E.F.M.3
Oehrlein, G.S.4
Cook, J.M.5
-
38
-
-
0037279636
-
8-based plasmas
-
8-based plasmas. J. Vacuum Sci. Tech. A 2003, 21(1):284-293.
-
(2003)
J. Vacuum Sci. Tech. A
, vol.21
, Issue.1
, pp. 284-293
-
-
Li, X.1
-
39
-
-
21644478383
-
2 layer systems using fluorocarbon plasmas
-
2 layer systems using fluorocarbon plasmas. Microelect. Engin. 2005, 81:15-21.
-
(2005)
Microelect. Engin.
, vol.81
, pp. 15-21
-
-
Milenin, A.P.1
-
40
-
-
84882887590
-
Deep reactive ion etching for bulk micromachining of silicon carbide
-
The MEMS Handbook, Editor Gad-el Hak, Chapter 21 21-1-21-12
-
G. M. Beheim, Deep reactive ion etching for bulk micromachining of silicon carbide, The MEMS Handbook, Editor Gad-el Hak, Chapter 21, 2002, pp. 21-1-21-12.
-
(2002)
-
-
Beheim, G.M.1
-
42
-
-
33845311370
-
High aspect ratio parylene etching for microfluidics and BioMEMS
-
Meng E., Aoyagi S., Tai Y.-C. High aspect ratio parylene etching for microfluidics and BioMEMS. Proc. MicroTAS 2004, 2:401.
-
(2004)
Proc. MicroTAS
, vol.2
, pp. 401
-
-
Meng, E.1
Aoyagi, S.2
Tai, Y.-C.3
-
43
-
-
34249071977
-
A MEMS-based tunable coplanar patch antenna fabricated using PCB processing techniques
-
Maddela M., Ramadoss R., Lempkowski R. A MEMS-based tunable coplanar patch antenna fabricated using PCB processing techniques. J. Micromech. Microeng. 2007, 17:812-819.
-
(2007)
J. Micromech. Microeng.
, vol.17
, pp. 812-819
-
-
Maddela, M.1
Ramadoss, R.2
Lempkowski, R.3
-
44
-
-
84945911066
-
-
G. Hong, A.S. Holmes, M.E. Heaton: DTIP 2003, Mandelieu-La Napoule, France, 5-7 May 2003, 268-271.
-
(2003)
DTIP 2003, Mandelieu-La Napoule, France, 5-7 May
, pp. 268-271
-
-
Hong, G.1
Holmes, A.S.2
Heaton, M.E.3
-
45
-
-
33947592417
-
Fabrication of vertical mirrors using plasma etch and KOH:IPA polishing
-
Agarwal R., Samson S., Bhansali S. Fabrication of vertical mirrors using plasma etch and KOH:IPA polishing. J. Micromech. Microeng. 2007, 17:26.
-
(2007)
J. Micromech. Microeng.
, vol.17
, pp. 26
-
-
Agarwal, R.1
Samson, S.2
Bhansali, S.3
-
46
-
-
22144494719
-
Advanced etching of silicon based on deep reactive ion etching for silicon high aspect ratio microstructures and three-dimensional micro- and nanostructures
-
Marty F., et al. Advanced etching of silicon based on deep reactive ion etching for silicon high aspect ratio microstructures and three-dimensional micro- and nanostructures. Microelect. J. 2005, 36:673-677.
-
(2005)
Microelect. J.
, vol.36
, pp. 673-677
-
-
Marty, F.1
-
47
-
-
31044456727
-
Matrix of 10*10 addressed solid propellant microthrusters: review of the technologies
-
Rossi C., et al. Matrix of 10*10 addressed solid propellant microthrusters: review of the technologies. Sens. Actuators A 2006, 126:241-252.
-
(2006)
Sens. Actuators A
, vol.126
, pp. 241-252
-
-
Rossi, C.1
-
48
-
-
2342471302
-
Influence of master fabrication techniques on the characteristics of embossed microfluidic channels
-
Esch M.B., Kapur S., Irizarry G., Genova V. Influence of master fabrication techniques on the characteristics of embossed microfluidic channels. Lab. Chip 2003, 3:121-127.
-
(2003)
Lab. Chip
, vol.3
, pp. 121-127
-
-
Esch, M.B.1
Kapur, S.2
Irizarry, G.3
Genova, V.4
-
49
-
-
2342540968
-
Disposable integrated microfluidics with self-aligned planar microlenses
-
Seo J., Lee L.P. Disposable integrated microfluidics with self-aligned planar microlenses. Sens. Actuators B 2004, 99:615-622.
-
(2004)
Sens. Actuators B
, vol.99
, pp. 615-622
-
-
Seo, J.1
Lee, L.P.2
-
50
-
-
34548204845
-
Development of dual-etch via tapering for through-silicon interconnects
-
Nagarajan R., Prasad K., Ebin L., Naravan B. Development of dual-etch via tapering for through-silicon interconnects. Sens. Actuators A 2007, 139:323.
-
(2007)
Sens. Actuators A
, vol.139
, pp. 323
-
-
Nagarajan, R.1
Prasad, K.2
Ebin, L.3
Naravan, B.4
-
52
-
-
0017526342
-
The loading effect in plasma etching
-
Mogab C.J. The loading effect in plasma etching. J. Electrochem. Soc. 1977, 124:1262.
-
(1977)
J. Electrochem. Soc.
, vol.124
, pp. 1262
-
-
Mogab, C.J.1
-
53
-
-
0001197855
-
Microscopic uniformity in plasma etching
-
Gottscho R.A., et al. Microscopic uniformity in plasma etching. J. Vac. Sci. Tech., B 1992, 10:2133-2147.
-
(1992)
J. Vac. Sci. Tech., B
, vol.10
, pp. 2133-2147
-
-
Gottscho, R.A.1
-
54
-
-
0034229039
-
Deceleration of silicon etch rate at high aspect ratios
-
Kiihamäki J. Deceleration of silicon etch rate at high aspect ratios. J. Vac. Sci. Tech. A 2000, 18:1385.
-
(2000)
J. Vac. Sci. Tech. A
, vol.18
, pp. 1385
-
-
Kiihamäki, J.1
-
55
-
-
84882814835
-
-
German Patent DE 19841964, GB-2,341,348
-
V. Becker, F. Laermer, A. Schilp, Anisotropic plasma etching of trenches in silicon by control of substrate temperature, German Patent DE 19841964, GB-2,341,348.
-
Anisotropic plasma etching of trenches in silicon by control of substrate temperature
-
-
Becker, V.1
Laermer, F.2
Schilp, A.3
-
56
-
-
33645340155
-
Pattern shape effects and artefacts in deep silicon etching
-
Kiihamäki J., Franssila S. Pattern shape effects and artefacts in deep silicon etching. J. Vac. Sci. Technol. A 1999, 17:2280.
-
(1999)
J. Vac. Sci. Technol. A
, vol.17
, pp. 2280
-
-
Kiihamäki, J.1
Franssila, S.2
-
57
-
-
32244434557
-
Design and fabrication of a micromachined planar patch-clamp substrate with integrated microfluidics for single-cell measurement
-
Matthews B., Judy J.W. Design and fabrication of a micromachined planar patch-clamp substrate with integrated microfluidics for single-cell measurement. J. Microelectromech. Syst. 2006, 15:214.
-
(2006)
J. Microelectromech. Syst.
, vol.15
, pp. 214
-
-
Matthews, B.1
Judy, J.W.2
-
58
-
-
0000830374
-
On the origin of the notching effect during etching in uniform high density plasmas
-
Hwang G.S., Giapis K.P. On the origin of the notching effect during etching in uniform high density plasmas. J. Vac. Sci. Technol. 1997, B15:70-87.
-
(1997)
J. Vac. Sci. Technol.
, vol.B15
, pp. 70-87
-
-
Hwang, G.S.1
Giapis, K.P.2
-
59
-
-
0032047890
-
Mechanism of charging reduction in pulsed plasma etching
-
Hwang G.S., Giapis K.P. Mechanism of charging reduction in pulsed plasma etching. Jpn. J. Appl. Phys. 1998, 37:2291-2301.
-
(1998)
Jpn. J. Appl. Phys.
, vol.37
, pp. 2291-2301
-
-
Hwang, G.S.1
Giapis, K.P.2
-
60
-
-
0346651219
-
Charging of pattern features during plasma etching
-
Arnold J.C., Sawin H.H. Charging of pattern features during plasma etching. J. Appl. Phys. 1991, 70:5314.
-
(1991)
J. Appl. Phys.
, vol.70
, pp. 5314
-
-
Arnold, J.C.1
Sawin, H.H.2
-
61
-
-
3342940826
-
-
Nozawa T., Kinoshita T., Nishizuka T., Narai A., Inoue T., Nakaue A. Dry Process Symposium I 1994, 8:37-41.
-
(1994)
Dry Process Symposium I
, vol.8
, pp. 37-41
-
-
Nozawa, T.1
Kinoshita, T.2
Nishizuka, T.3
Narai, A.4
Inoue, T.5
Nakaue, A.6
-
62
-
-
34547674890
-
Atomic layer deposition enhanced rapid dry fabrication of micromechanical devices with cryogenic deep reactive ion etching
-
Chekurov N., et al. Atomic layer deposition enhanced rapid dry fabrication of micromechanical devices with cryogenic deep reactive ion etching. J. Micromech. Microeng. 2007, 17:1731-1736.
-
(2007)
J. Micromech. Microeng.
, vol.17
, pp. 1731-1736
-
-
Chekurov, N.1
-
63
-
-
33745176252
-
Layout controlled one-step dry etch and release of MEMS using deep RIE on SOI wafer
-
Haobing L., Chollet F. Layout controlled one-step dry etch and release of MEMS using deep RIE on SOI wafer. J. Microelectromech. Syst. 2006, 15:541.
-
(2006)
J. Microelectromech. Syst.
, vol.15
, pp. 541
-
-
Haobing, L.1
Chollet, F.2
-
65
-
-
3042701556
-
MEMS for watches
-
Noell W., Clerc P.-A., Jeanneret S., Hoogerwerf A., Niedermann P., Perret A., de Rooij N.F. MEMS for watches. IEEE MEMS 2004, 1-4.
-
(2004)
IEEE MEMS
, pp. 1-4
-
-
Noell, W.1
Clerc, P.-A.2
Jeanneret, S.3
Hoogerwerf, A.4
Niedermann, P.5
Perret, A.6
de Rooij, N.F.7
-
66
-
-
17144406379
-
Microfabrication of 3D silicon MEMS structures using a gray-scale lithography and deep reactive ion etching
-
Waits C.M., Morgan B., Kastantin M., Ghodssi R. Microfabrication of 3D silicon MEMS structures using a gray-scale lithography and deep reactive ion etching. Sens. Actuators A 2005, 119:245-253.
-
(2005)
Sens. Actuators A
, vol.119
, pp. 245-253
-
-
Waits, C.M.1
Morgan, B.2
Kastantin, M.3
Ghodssi, R.4
-
67
-
-
33646436962
-
Increase of electrospray throughput using multiplexed microfabricated sources for the scalable generation of monodisperse droplets
-
Deng W., et al. Increase of electrospray throughput using multiplexed microfabricated sources for the scalable generation of monodisperse droplets. Aerosol Sci. 2006, 37:696-714.
-
(2006)
Aerosol Sci.
, vol.37
, pp. 696-714
-
-
Deng, W.1
-
68
-
-
33750018189
-
A microfabricated nebulizer for liquid vaporization in chemical analysis
-
Franssila S., Marttila S., Kolari K., Östman P., Kotiaho T., Kostiainen R., Lehtiniemi R., Fager C.-M., Manninen J. A microfabricated nebulizer for liquid vaporization in chemical analysis. J. Microelectromech. Syst. 2006, 15:1251.
-
(2006)
J. Microelectromech. Syst.
, vol.15
, pp. 1251
-
-
Franssila, S.1
Marttila, S.2
Kolari, K.3
Östman, P.4
Kotiaho, T.5
Kostiainen, R.6
Lehtiniemi, R.7
Fager, C.-M.8
Manninen, J.9
-
69
-
-
0035426203
-
Microfabrication of a high pressure bipropellant rocket engine
-
London A.P., et al. Microfabrication of a high pressure bipropellant rocket engine. Sens. Actuators A 2001, 92:351.
-
(2001)
Sens. Actuators A
, vol.92
, pp. 351
-
-
London, A.P.1
-
70
-
-
23944439989
-
A radial microfluidic fuel processor
-
Pattekar A.V., Kothare M.K. A radial microfluidic fuel processor. J. Power Sources 2005, 147:116-127.
-
(2005)
J. Power Sources
, vol.147
, pp. 116-127
-
-
Pattekar, A.V.1
Kothare, M.K.2
-
71
-
-
0032183430
-
Effect of MEMS-compatible thin film hard coatings on the erosion resistance of silicon micromachined atomizers
-
Rajan N., et al. Effect of MEMS-compatible thin film hard coatings on the erosion resistance of silicon micromachined atomizers. Surface Coatings Technol. 1998, 108-109:391-397.
-
(1998)
Surface Coatings Technol.
, vol.108-109
, pp. 391-397
-
-
Rajan, N.1
-
72
-
-
33745821180
-
Modeling and fabrication of capillary stop valves for planar microfluidic systems
-
Glière A., Delattre C. Modeling and fabrication of capillary stop valves for planar microfluidic systems. Sens. Actuators A 2006, 130-131:601-608.
-
(2006)
Sens. Actuators A
, vol.130-131
, pp. 601-608
-
-
Glière, A.1
Delattre, C.2
-
73
-
-
2342570918
-
A liquid-triggered liquid microvalve for on-chip flow control
-
Melin J., et al. A liquid-triggered liquid microvalve for on-chip flow control. Sens. Actuators B 2004, 100:463-468.
-
(2004)
Sens. Actuators B
, vol.100
, pp. 463-468
-
-
Melin, J.1
-
74
-
-
0031165299
-
Micromachined flat-walled valveless diffuser pumps
-
Olsson A., Enoksson P., Stemme G., Stemme E. Micromachined flat-walled valveless diffuser pumps. J. Microelectromech. Syst. 1997, 6:161.
-
(1997)
J. Microelectromech. Syst.
, vol.6
, pp. 161
-
-
Olsson, A.1
Enoksson, P.2
Stemme, G.3
Stemme, E.4
-
75
-
-
33344456307
-
High-fill-factor adaptive optics mirrors with independent piston, tip and tilt controls
-
Greywall D.S. High-fill-factor adaptive optics mirrors with independent piston, tip and tilt controls. J. Micromech. Microeng. 2006, 16:N1-N7.
-
(2006)
J. Micromech. Microeng.
, vol.16
-
-
Greywall, D.S.1
-
76
-
-
34247576254
-
Nanometer scale gaps for capacitive transduction improvement on RF-MEMS resonators
-
Torres F., et al. Nanometer scale gaps for capacitive transduction improvement on RF-MEMS resonators. Microelec. Eng. 2007, 84:1384-1887.
-
(2007)
Microelec. Eng.
, vol.84
, pp. 1384-1887
-
-
Torres, F.1
-
77
-
-
33244456578
-
A microstructured silicon membrane with entrapped hydrogels for environmentally sensitive fluid gating
-
Baldi A., Lei M., Gu Y., Stiegel R.A., Ziaie B. A microstructured silicon membrane with entrapped hydrogels for environmentally sensitive fluid gating. Sens. Actuators 2006, B114:9-18.
-
(2006)
Sens. Actuators
, vol.B114
, pp. 9-18
-
-
Baldi, A.1
Lei, M.2
Gu, Y.3
Stiegel, R.A.4
Ziaie, B.5
-
78
-
-
19944429711
-
Cavitation in flow through a micro-orifice inside a silicon microchannel
-
Mishra C., Peles Y. Cavitation in flow through a micro-orifice inside a silicon microchannel. Phys. Fluids 2005, 17:013601.
-
(2005)
Phys. Fluids
, vol.17
, pp. 013601
-
-
Mishra, C.1
Peles, Y.2
-
79
-
-
7444224648
-
Silicon chip-based patch-clamp electrodes integrated with PDMS microfluidics
-
Pantoja R., et al. Silicon chip-based patch-clamp electrodes integrated with PDMS microfluidics. Biosens. Bioel. 2004, 20:509-517.
-
(2004)
Biosens. Bioel.
, vol.20
, pp. 509-517
-
-
Pantoja, R.1
-
80
-
-
9744229263
-
Microsystem with integrated capillary leak to mass spectrometer for high sensitivity temperature programmed desorption
-
Quaade U.J., Jensen S., Hansen O. Microsystem with integrated capillary leak to mass spectrometer for high sensitivity temperature programmed desorption. Rev. Sci. Instr. 2004, 75:3345.
-
(2004)
Rev. Sci. Instr.
, vol.75
, pp. 3345
-
-
Quaade, U.J.1
Jensen, S.2
Hansen, O.3
-
81
-
-
36749096405
-
Rapid fabrication of high aspect ratio silicon nanopillars for chemical analysis
-
Sainiemi L., Keskinen H., Aromaa M., Luosujärvi L., Grigoras K., Kotiaho T., Mäkelä J., Franssila S. Rapid fabrication of high aspect ratio silicon nanopillars for chemical analysis. Nanotechnology 2007, 18:505303.
-
(2007)
Nanotechnology
, vol.18
, pp. 505303
-
-
Sainiemi, L.1
Keskinen, H.2
Aromaa, M.3
Luosujärvi, L.4
Grigoras, K.5
Kotiaho, T.6
Mäkelä, J.7
Franssila, S.8
-
82
-
-
33645085037
-
High-throughput design and fabrication of an integrated microsystem with high aspect ratio sub-micron pillar arrays for free-solution microcapillary electrophoresis
-
Chan Y.C., Lee Y.-K., Zohar Y. High-throughput design and fabrication of an integrated microsystem with high aspect ratio sub-micron pillar arrays for free-solution microcapillary electrophoresis. J. Micromech. Microeng. 2006, 16:699.
-
(2006)
J. Micromech. Microeng.
, vol.16
, pp. 699
-
-
Chan, Y.C.1
Lee, Y.-K.2
Zohar, Y.3
-
83
-
-
0033324414
-
The benefits of process parameter ramping during plasma etching of high aspect ratio silicon structures
-
Hopkins J., Ashraf H., Bhardwaj J.K., Hynes A.M., Johnston I., Shepherd J.N. The benefits of process parameter ramping during plasma etching of high aspect ratio silicon structures. Mat. Res. Soc. Symp. Proc. 1999, 546:63.
-
(1999)
Mat. Res. Soc. Symp. Proc.
, vol.546
, pp. 63
-
-
Hopkins, J.1
Ashraf, H.2
Bhardwaj, J.K.3
Hynes, A.M.4
Johnston, I.5
Shepherd, J.N.6
-
84
-
-
0032674784
-
Recent advances in silicon etching for MEMS using the ASE™ process
-
Hynes A.M., Ashraf H., Bhardwaj J.K., Hopkins J., Johnston I., Shepherd J.N. Recent advances in silicon etching for MEMS using the ASE™ process. Sens. Actuators A 1999, 74:13.
-
(1999)
Sens. Actuators A
, vol.74
, pp. 13
-
-
Hynes, A.M.1
Ashraf, H.2
Bhardwaj, J.K.3
Hopkins, J.4
Johnston, I.5
Shepherd, J.N.6
-
85
-
-
33750377080
-
Fabrication and characterization of DRIE-micromachined electrostatic microactuators for hard disk drives
-
Chen B., Miao J., Tay F.E.H. Fabrication and characterization of DRIE-micromachined electrostatic microactuators for hard disk drives. Microsyst. Technol. 2007, 13:11-19.
-
(2007)
Microsyst. Technol.
, vol.13
, pp. 11-19
-
-
Chen, B.1
Miao, J.2
Tay, F.E.H.3
-
86
-
-
0037871729
-
Side-opened out-of-plane microneedles for microfluidic transdermal liquid transfer
-
Griss P., Stemme G. Side-opened out-of-plane microneedles for microfluidic transdermal liquid transfer. J. Microelectromech. Syst. 2003, 12:296-301.
-
(2003)
J. Microelectromech. Syst.
, vol.12
, pp. 296-301
-
-
Griss, P.1
Stemme, G.2
-
87
-
-
24944508964
-
Silicon microneedle electrode array with temperature moni-toring for electroporation
-
Wilke N., Hibert C., O'Brien J., Morrissey A. Silicon microneedle electrode array with temperature moni-toring for electroporation. Sens. Actuators A 2005, 123-124:319-325.
-
(2005)
Sens. Actuators A
, vol.123-124
, pp. 319-325
-
-
Wilke, N.1
Hibert, C.2
O'Brien, J.3
Morrissey, A.4
-
88
-
-
33645052181
-
A micromachined thin-film gas flow sensor for microchemical reactors
-
Shin W.C., Besser R.S. A micromachined thin-film gas flow sensor for microchemical reactors. J. Micromech. Microeng. 2006, 16:731-741.
-
(2006)
J. Micromech. Microeng.
, vol.16
, pp. 731-741
-
-
Shin, W.C.1
Besser, R.S.2
-
89
-
-
0030710904
-
Power MEMS and microengines
-
Chicago, IL
-
A.H. Epstein, et al. Power MEMS and microengines, in: IEEE Transducers '97 Conference, Chicago, IL, 1997, 753-756.
-
(1997)
IEEE Transducers '97 Conference
, pp. 753-756
-
-
Epstein, A.H.1
-
90
-
-
23944440515
-
Studies on a micro combustor for gas turbine engines
-
Shan X.C., et al. Studies on a micro combustor for gas turbine engines. J. Micromech. Microeng. 2005, 15:S215-S221.
-
(2005)
J. Micromech. Microeng.
, vol.15
-
-
Shan, X.C.1
-
91
-
-
0742301752
-
Silicon micromachined hollow microneedles for transdermal liquid transport
-
Gardeniers H.J.G.E., Luttge R., Berenschot E.J.W., de Boer M.J., Yeshurun S.Y., Hefetz M., van't Oever R., van den Berg A. Silicon micromachined hollow microneedles for transdermal liquid transport. J. Microelectromech. Syst. 2003, 12:855-862.
-
(2003)
J. Microelectromech. Syst.
, vol.12
, pp. 855-862
-
-
Gardeniers, H.J.G.E.1
Luttge, R.2
Berenschot, E.J.W.3
de Boer, M.J.4
Yeshurun, S.Y.5
Hefetz, M.6
van't Oever, R.7
van den Berg, A.8
-
92
-
-
0242551734
-
A microbubble-powered bioparticle actuator
-
Maxwell R.B., et al. A microbubble-powered bioparticle actuator. J. Microelectromech. Syst. 2003, 12:630.
-
(2003)
J. Microelectromech. Syst.
, vol.12
, pp. 630
-
-
Maxwell, R.B.1
-
93
-
-
18544382818
-
Microfabrication and characterization of a silicon-based millimeter scale PEM fuel cell operating with hydrogen, methanol, or formic acid
-
Yeom J., et al. Microfabrication and characterization of a silicon-based millimeter scale PEM fuel cell operating with hydrogen, methanol, or formic acid. Sens. Actuators B 2005, 107:882-891.
-
(2005)
Sens. Actuators B
, vol.107
, pp. 882-891
-
-
Yeom, J.1
-
94
-
-
0032023865
-
Low-stiffness silicon cantilevers with integrated heaters and piezoresistive sensors for high-density AFM thermomechanical data storage
-
Chui B.W., et al. Low-stiffness silicon cantilevers with integrated heaters and piezoresistive sensors for high-density AFM thermomechanical data storage. J. Microelectromech. Syst. 1998, 7:69.
-
(1998)
J. Microelectromech. Syst.
, vol.7
, pp. 69
-
-
Chui, B.W.1
-
95
-
-
34547664812
-
IR imaging using a cantilever-based focal plane array fabricated by deep reactive ion etching technique
-
Wang X., et al. IR imaging using a cantilever-based focal plane array fabricated by deep reactive ion etching technique. Appl. Phys. Lett. 2007, 91:054109.
-
(2007)
Appl. Phys. Lett.
, vol.91
, pp. 054109
-
-
Wang, X.1
-
96
-
-
4344679112
-
In-plane single-crystal-silicon microneedles for minimally invasive microfluid system
-
Paik S.-J., et al. In-plane single-crystal-silicon microneedles for minimally invasive microfluid system. Sens. Actuators A 2004, 114:276-284.
-
(2004)
Sens. Actuators A
, vol.114
, pp. 276-284
-
-
Paik, S.-J.1
-
97
-
-
33847301594
-
Design and characterization of microfabricated piezoresistive floating element-based shear stress sensors
-
Barlian A.A., et al. Design and characterization of microfabricated piezoresistive floating element-based shear stress sensors. Sens. Actuators 2007, A134:77-87.
-
(2007)
Sens. Actuators
, vol.A134
, pp. 77-87
-
-
Barlian, A.A.1
-
98
-
-
17144379361
-
Fabrication of a high-temperature microreactor with integrated heater and sensor patterns on an ultrathin silicon membrane
-
Tiggelaar R.M., et al. Fabrication of a high-temperature microreactor with integrated heater and sensor patterns on an ultrathin silicon membrane. Sens. Actuators A 2005, 119:196-205.
-
(2005)
Sens. Actuators A
, vol.119
, pp. 196-205
-
-
Tiggelaar, R.M.1
-
99
-
-
4344614531
-
A 5-V operated MEMS variable optical attenuator by SOI bulk micromachining
-
Isamoto K., et al. A 5-V operated MEMS variable optical attenuator by SOI bulk micromachining. IEEE Sel. Topics Quantum Elect. 2004, 10:570.
-
(2004)
IEEE Sel. Topics Quantum Elect.
, vol.10
, pp. 570
-
-
Isamoto, K.1
-
100
-
-
0037765115
-
Micro pinball game demonstrating an easy MEMS transfer process using room temperature plasma bonding
-
Bring M., Sanz-Velasco A., Rödjegård H., Enoksson P. Micro pinball game demonstrating an easy MEMS transfer process using room temperature plasma bonding. J. Micromech. Microeng. 2003, 13:S51-S56.
-
(2003)
J. Micromech. Microeng.
, vol.13
-
-
Bring, M.1
Sanz-Velasco, A.2
Rödjegård, H.3
Enoksson, P.4
-
101
-
-
33749320317
-
Back side exposure of variable size through silicon vias
-
Rowbotham T., et al. Back side exposure of variable size through silicon vias. J. Vac. Sci. Technol. B 2006, 24(5):2460.
-
(2006)
J. Vac. Sci. Technol. B
, vol.24
, Issue.5
, pp. 2460
-
-
Rowbotham, T.1
-
102
-
-
0342906553
-
Depth and profile control in plasma etched MEMS structures
-
Kiihamäki J., Kattelus H., Karttunen J., Franssila S. Depth and profile control in plasma etched MEMS structures. Sens. Actuators 2000, 82:234-238.
-
(2000)
Sens. Actuators
, vol.82
, pp. 234-238
-
-
Kiihamäki, J.1
Kattelus, H.2
Karttunen, J.3
Franssila, S.4
-
103
-
-
44649120771
-
Fabrication fluidic characterization of micro-pillar array electrospray ionization chip
-
doi:10.1016/j.snb.2007.09.077
-
L. Sainiemi, T. Nissilä, V. Jokinen, T. Sikanen, T. Kotiaho, R. Kostiainen, R.A. Ketola, S. Franssila, Fabrication fluidic characterization of micro-pillar array electrospray ionization chip, Sens. Actuators B Chem. (2007) doi: 10.1016/j.snb.2007.09.077.
-
(2007)
Sens. Actuators B Chem.
-
-
Sainiemi, L.1
Nissilä, T.2
Jokinen, V.3
Sikanen, T.4
Kotiaho, T.5
Kostiainen, R.6
Ketola, R.A.7
Franssila, S.8
-
104
-
-
0035971844
-
Hydrophobic valves of plasma deposited octafluorobutane in DRIE channels
-
Andersson H., van der Wijngaart W., Griss P., Niklaus F., Steeme G. Hydrophobic valves of plasma deposited octafluorobutane in DRIE channels. Sens. Actuators 2001, B75:136-141.
-
(2001)
Sens. Actuators
, vol.B75
, pp. 136-141
-
-
Andersson, H.1
van der Wijngaart, W.2
Griss, P.3
Niklaus, F.4
Steeme, G.5
-
105
-
-
33745488673
-
Tunable hydrophilicity on a hydrophobic fluorocarbon polymer coating on silicon
-
Kolari K., Hokkanen A. Tunable hydrophilicity on a hydrophobic fluorocarbon polymer coating on silicon. J. Vac. Sci. Tech. A 2006, 24:1005.
-
(2006)
J. Vac. Sci. Tech. A
, vol.24
, pp. 1005
-
-
Kolari, K.1
Hokkanen, A.2
-
106
-
-
54949087122
-
Complex droplets on chemically modified silicon nanograss
-
V. Jokinen, L. Sainiemi, S. Franssila, Complex droplets on chemically modified silicon nanograss, Adv. Mat. (2008).
-
(2008)
Adv. Mat.
-
-
Jokinen, V.1
Sainiemi, L.2
Franssila, S.3
-
107
-
-
0033357523
-
Mesa-supported, single-crystal microstructures fabricated by the surface/bulk micromachining process
-
Park S., et al. Mesa-supported, single-crystal microstructures fabricated by the surface/bulk micromachining process. Jpn. J. Appl. Phys. 1999, 38:4244.
-
(1999)
Jpn. J. Appl. Phys.
, vol.38
, pp. 4244
-
-
Park, S.1
-
108
-
-
0030233744
-
SCREAM MicroElectroMechanical Systems
-
MacDonald N.C. SCREAM MicroElectroMechanical Systems. Microelect. Eng. 1996, 32:49-73.
-
(1996)
Microelect. Eng.
, vol.32
, pp. 49-73
-
-
MacDonald, N.C.1
-
109
-
-
0033702573
-
Controlling and testing the fracture strength of silicon on the mesoscale
-
Chen K.-S., et al. Controlling and testing the fracture strength of silicon on the mesoscale. J. Am. Ceram. Soc. 2000, 83:1476-1484.
-
(2000)
J. Am. Ceram. Soc.
, vol.83
, pp. 1476-1484
-
-
Chen, K.-S.1
-
110
-
-
0036601273
-
Effect of process parameters on the surface morphology and mechanical performance of silicon structures after deep reactive ion etching (DRIE)
-
Chen K.-S., et al. Effect of process parameters on the surface morphology and mechanical performance of silicon structures after deep reactive ion etching (DRIE). J. Microelectromech. Syst. 2002, 11:264.
-
(2002)
J. Microelectromech. Syst.
, vol.11
, pp. 264
-
-
Chen, K.-S.1
-
111
-
-
0031233514
-
Wet refinement of dry etched trenches in silicon
-
Kattelus H. Wet refinement of dry etched trenches in silicon. J. Electrochem. Soc. 1997, 144:3188.
-
(1997)
J. Electrochem. Soc.
, vol.144
, pp. 3188
-
-
Kattelus, H.1
-
112
-
-
0034428092
-
Anisotropically etched Si mold for solid polymer dye microcavity laser
-
Sasaki M., et al. Anisotropically etched Si mold for solid polymer dye microcavity laser. Jpn. J. Appl. Phys. 2000, 39:7145.
-
(2000)
Jpn. J. Appl. Phys.
, vol.39
, pp. 7145
-
-
Sasaki, M.1
-
113
-
-
33646194224
-
Fabrication of vertical optical plane using DRIE and KOH crystalline etching of (110) silicon wafer
-
Yun S.-S., You S.-K., Lee J.-H. Fabrication of vertical optical plane using DRIE and KOH crystalline etching of (110) silicon wafer. Sens. Actuators A 2006, 128:387-394.
-
(2006)
Sens. Actuators A
, vol.128
, pp. 387-394
-
-
Yun, S.-S.1
You, S.-K.2
Lee, J.-H.3
-
114
-
-
1942468589
-
The MEMSNAS process: microloading effect for micromachining 3D structures of nearly all shapes
-
T. Bourouina, T. Mazuzawa, H. Fujita: The MEMSNAS process: microloading effect for micromachining 3D structures of nearly all shapes, J. Microelectromech. Syst. 13 (2004).
-
(2004)
J. Microelectromech. Syst.
, vol.13
-
-
Bourouina, T.1
Mazuzawa, T.2
Fujita, H.3
-
115
-
-
0035397290
-
Plasma etched initial pits for electrochemically etched macroporous silicon structures
-
Grigoras K., Niskanen A.J., Franssila S. Plasma etched initial pits for electrochemically etched macroporous silicon structures. J. Micromech. Microeng. 2001, 11:371-375.
-
(2001)
J. Micromech. Microeng.
, vol.11
, pp. 371-375
-
-
Grigoras, K.1
Niskanen, A.J.2
Franssila, S.3
-
116
-
-
0037279442
-
Deep reactive ion etching characteristics of a micromachined chemical reactor
-
Besser R.S., Shin W.C. Deep reactive ion etching characteristics of a micromachined chemical reactor. J. Vac. Sci. Technol. B 2003, 21:912.
-
(2003)
J. Vac. Sci. Technol. B
, vol.21
, pp. 912
-
-
Besser, R.S.1
Shin, W.C.2
-
117
-
-
0036684902
-
Guidelines for etching silicon MEMS structures using fluorine high-density plasmas at cryogenic temperatures
-
de Boer M.J., Gardeniers J.G.E., Jansen H.V., Smulders E., Gilde M.-J., Roelofs G., Sasserath J.N., Elwenspoek M. Guidelines for etching silicon MEMS structures using fluorine high-density plasmas at cryogenic temperatures. J. Microelectromech. Sys. 2002, 11(4):385-401.
-
(2002)
J. Microelectromech. Sys.
, vol.11
, Issue.4
, pp. 385-401
-
-
de Boer, M.J.1
Gardeniers, J.G.E.2
Jansen, H.V.3
Smulders, E.4
Gilde, M.-J.5
Roelofs, G.6
Sasserath, J.N.7
Elwenspoek, M.8
-
118
-
-
0000120994
-
Notching as an example of charging in uniform high density plasmas
-
Kinoshita T., Hane M., McVittie J.P. Notching as an example of charging in uniform high density plasmas. J. Vac. Sci. Technol. B 1996, 14:560-565.
-
(1996)
J. Vac. Sci. Technol. B
, vol.14
, pp. 560-565
-
-
Kinoshita, T.1
Hane, M.2
McVittie, J.P.3
-
119
-
-
38149111785
-
Deep plasma etching of glass with a silicon shadow mask
-
Kolari K. Deep plasma etching of glass with a silicon shadow mask. Sens. Actuators A 2008, 141:677-684.
-
(2008)
Sens. Actuators A
, vol.141
, pp. 677-684
-
-
Kolari, K.1
-
120
-
-
4444276761
-
A highly parallel picoliter dispenser with an integrated novel capillary structure
-
Steinert C.P., et al. A highly parallel picoliter dispenser with an integrated novel capillary structure. Sens. Actuators A 2004, 116:171-177.
-
(2004)
Sens. Actuators A
, vol.116
, pp. 171-177
-
-
Steinert, C.P.1
-
121
-
-
0032529964
-
Fabrication of nanocolumns for liquid chromatography
-
He B., Tait N., Regnier F. Fabrication of nanocolumns for liquid chromatography. Anal. Chem. 1998, 70:3790-3797.
-
(1998)
Anal. Chem.
, vol.70
, pp. 3790-3797
-
-
He, B.1
Tait, N.2
Regnier, F.3
-
122
-
-
0034250670
-
Micromachined flow-through filter-chamber for chemical reactions on beads
-
Andersson H., van der Wijngaart W., Enoksson P., Stemme G. Micromachined flow-through filter-chamber for chemical reactions on beads. Sens. Actuators 2000, B67:203-208.
-
(2000)
Sens. Actuators
, vol.B67
, pp. 203-208
-
-
Andersson, H.1
van der Wijngaart, W.2
Enoksson, P.3
Stemme, G.4
-
123
-
-
44149084035
-
High etching selectivity for plasma etching glass with AlN and Al2O3 masks
-
K. Kolari, High etching selectivity for plasma etching glass with AlN and Al2O3 masks, Microelect. Engin. (2008).
-
(2008)
Microelect. Engin.
-
-
Kolari, K.1
|