Microfabrication of 3D silicon MEMS structures using gray-scale lithography and deep reactive ion etching

Sensors and Actuators, A: Physical

Volumn 119, Issue 1, 2005, Pages 245-253

  Waits, C M ^a   Morgan, B ^a   Kastantin, M ^a   Ghodssi, R ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

DRIE; Etch selectivity; Gray scale lithography; MEMS

Indexed keywords

ANISOTROPY; COMPRESSORS; ELECTRODES; FABRICATION; LITHOGRAPHY; MICROSTRUCTURE; REACTIVE ION ETCHING; SILICON; SURFACE ROUGHNESS; THREE DIMENSIONAL;

DEEP REACTIVE ION ETCHING (DRIE); ETCH SELECTIVITY; GRAY-SCALE LITHOGRAPHY; MEMS;

MICROELECTROMECHANICAL DEVICES;

EID: 17144406379     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(04)00193-1     Document Type: Article

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