-
3
-
-
0031072583
-
RIE lag in high aspect ratio trench etching of silicon
-
Jansen H, de Boer M, Wiegerink R, Tas N, Smulders E, Neagu C and Elwenspoek M 1997 RIE lag in high aspect ratio trench etching of silicon Microelectron. Eng. 35 45-50
-
(1997)
Microelectron. Eng.
, vol.35
, pp. 45-50
-
-
Jansen, H.1
De Boer, M.2
Wiegerink, R.3
Tas, N.4
Smulders, E.5
Neagu, C.6
Elwenspoek, M.7
-
4
-
-
0030091527
-
A survey on the reactive ion etching of silicon in microtechnology
-
Jansen H, Gardeniers H, de Boer M, Elwenspoek M and Fluitman J 1996 A survey on the reactive ion etching of silicon in microtechnology J. Micromech. Microeng. 6 14-28
-
(1996)
J. Micromech. Microeng.
, vol.6
, pp. 14-28
-
-
Jansen, H.1
Gardeniers, H.2
De Boer, M.3
Elwenspoek, M.4
Fluitman, J.5
-
5
-
-
0000394072
-
Fabrication of SOI wafers with buried cavities using silicon fusion bonding and electrochemical etchback
-
Noworolski J M, Klaassen E, Logan J, Petersen K and Maluf N I 1996 Fabrication of SOI wafers with buried cavities using silicon fusion bonding and electrochemical etchback Sensors Actuators A 54 709-13
-
(1996)
Sensors Actuators A
, vol.54
, pp. 709-713
-
-
Noworolski, J.M.1
Klaassen, E.2
Logan, J.3
Petersen, K.4
Maluf, N.I.5
-
6
-
-
0034468212
-
Fabrication of silicon and oxide membranes over cavities using ion-cut layer transfer
-
Yun C H and Cheung N W 2000 Fabrication of silicon and oxide membranes over cavities using ion-cut layer transfer J. Microelectromech. Syst. 9 474-7
-
(2000)
J. Microelectromech. Syst.
, vol.9
, pp. 474-477
-
-
Yun, C.H.1
Cheung, N.W.2
-
7
-
-
0035605842
-
Low-temperature wafer-level transfer bonding
-
Niklaus F, Enoksson P, Griss P, Kälvesten E and Stemme G 2001 Low-temperature wafer-level transfer bonding J. Microelectromech. Syst. 10 525-31
-
(2001)
J. Microelectromech. Syst.
, vol.10
, pp. 525-531
-
-
Niklaus, F.1
Enoksson, P.2
Griss, P.3
Kälvesten, E.4
Stemme, G.5
-
8
-
-
0033904174
-
Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging
-
Cheng Y T and Lin L 2000 Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging J. Microelectromech. Syst. 9 3-8
-
(2000)
J. Microelectromech. Syst.
, vol.9
, pp. 3-8
-
-
Cheng, Y.T.1
Lin, L.2
-
9
-
-
0036735653
-
A low-temperature wafer bonding technique using patternable materials
-
Pan C-T, Yang H, Shen S-C, Chou M-C and Chou H-P 2002 A low-temperature wafer bonding technique using patternable materials J. Micromech. Microeng. 12 611-5
-
(2002)
J. Micromech. Microeng.
, vol.12
, pp. 611-615
-
-
Pan, C.-T.1
Yang, H.2
Shen, S.-C.3
Chou, M.-C.4
Chou, H.-P.5
-
11
-
-
0036851992
-
Double-sided bulk micromachining of silicon-on-insulator films using room-temperature oxygen plasma assisted bonding
-
Sanz-Velasco A, Rödjegård H and Andersson G I 2002 Double-sided bulk micromachining of silicon-on-insulator films using room-temperature oxygen plasma assisted bonding J. Micromech. Microeng. 12 786-94
-
(2002)
J. Micromech. Microeng.
, vol.12
, pp. 786-794
-
-
Sanz-Velasco, A.1
Rödjegård, H.2
Andersson, G.I.3
-
13
-
-
0031375239
-
Hybrid postprocessing etching for CMOS-compatible MEMS
-
Tea N H, Milanovic V, Zincke C A, Suehle J S, Gaitan M, Zaghloul M E and Geist J 1997 Hybrid postprocessing etching for CMOS-compatible MEMS J. Microelectromech. Syst. 6 363-72
-
(1997)
J. Microelectromech. Syst.
, vol.6
, pp. 363-372
-
-
Tea, N.H.1
Milanovic, V.2
Zincke, C.A.3
Suehle, J.S.4
Gaitan, M.5
Zaghloul, M.E.6
Geist, J.7
-
14
-
-
0022914969
-
Mechanism of silicon surface roughening by reactive ion etching
-
Oehrlein G S, Schad R G and Jaso M A 1986 Mechanism of silicon surface roughening by reactive ion etching Surf. Interface Anal. 8 243-6
-
(1986)
Surf. Interface Anal.
, vol.8
, pp. 243-246
-
-
Oehrlein, G.S.1
Schad, R.G.2
Jaso, M.A.3
-
16
-
-
0034226179
-
Formation of silicon structures by plasma-activated wafer bonding
-
Amirfeiz P, Bengtsson S, Bergh M, Zanghellini E and Börjesson L 2000 Formation of silicon structures by plasma-activated wafer bonding J. Electrochem. Soc. 147 2693-8
-
(2000)
J. Electrochem. Soc.
, vol.147
, pp. 2693-2698
-
-
Amirfeiz, P.1
Bengtsson, S.2
Bergh, M.3
Zanghellini, E.4
Börjesson, L.5
-
17
-
-
0034275514
-
Micro-discharge and electric breakdown in a micro-gap
-
Ono T, Sim D Y and Esashi M 2000 Micro-discharge and electric breakdown in a micro-gap J. Micromech. Microeng. 10 445-51
-
(2000)
J. Micromech. Microeng.
, vol.10
, pp. 445-451
-
-
Ono, T.1
Sim, D.Y.2
Esashi, M.3
-
19
-
-
0037238656
-
Materials selection for microfabricated electrostatic actuators
-
Srikar V T and Spearing S M 2003 Materials selection for microfabricated electrostatic actuators Sensors Actuators A 102 279-85
-
(2003)
Sensors Actuators A
, vol.102
, pp. 279-285
-
-
Srikar, V.T.1
Spearing, S.M.2
|