Cyclic deep reactive ion etching with mask replenishment

Journal of Micromechanics and Microengineering

Volumn 17, Issue 9, 2007, Pages 1773-1780

  Adam, T N ^a,b   Kim, S ^a   Lv, P C ^a   Xuan, G ^a   Ray, S K ^a   Troeger, R T ^a   Prather, D ^a   Kolodzey, J ^a  

^a UNIVERSITY OF DELAWARE   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOSCH PROCESSES; CLOSELY PACKED STRUCTURES; MASKING LAYERS; MULTI-STEP;

ABS RESINS; ANISOTROPY; ASPECT RATIO; ETCHING; INDUCTIVELY COUPLED PLASMA; PHOTORESISTS; PLASMA DENSITY; POLYMERS; SILICON;

REACTIVE ION ETCHING;

EID: 51649101854     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/17/9/004     Document Type: Conference Paper

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