Fabrication of high-density electrical feed-throughs by deep-reactive-ion etching of Pyrex glass

Journal of Microelectromechanical Systems

Volumn 11, Issue 6, 2002, Pages 625-630

  Li, Xinghua ^a   Abe, Takashi ^a   Liu, Yongxun ^a   Esashi, Masayoshi ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Chemical mechanical polishing (CMP); Deep reactive ion etching (DRIE); High density electrical feed throughs; Pyrex glass

Indexed keywords

CHEMICAL MECHANICAL POLISHING; ELECTRIC RESISTANCE; ELECTROPLATED PRODUCTS; ETCHING; NICKEL;

PYREX GLASS;

MICROELECTROMECHANICAL DEVICES;

EID: 0036906239     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2002.805211     Document Type: Article

References (12)

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