Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

ACS Applied Materials and Interfaces

Volumn 7, Issue 23, 2015, Pages 12597-12618

  Peng, Peng ^a,b   Hu, Anming ^c   Gerlich, Adrian P ^a   Zou, Guisheng ^d   Liu, Lei ^d   Zhou, Y Norman ^a,b,d  

^a UNIVERSITY OF WATERLOO   (Canada)

^b UNIVERSITY OF WATERLOO   (Canada)

^c University of Tennessee   (United States)

^d TSINGHUA UNIVERSITY   (China)

Author keywords

low temperature; mechanical properties; review on nanojoining; silver nanomaterials; size effects

Indexed keywords

FILLERS; JOINING; MECHANICAL PROPERTIES; MICROELECTRONICS; NANOSTRUCTURED MATERIALS; NANOWIRES; OPTICAL PROPERTIES; RAMAN SPECTROSCOPY; SINTERING; ULTRAFAST LASERS;

LARGE PLASTIC DEFORMATION; LOW TEMPERATURE DIFFUSION BONDINGS; LOW TEMPERATURES; MECHANICAL AND ELECTRICAL PROPERTIES; MICROELECTRONIC APPLICATIONS; SIZE EFFECTS; SURFACE ENHANCED RAMAN SPECTROSCOPY; VISIBLE-LIGHT IRRADIATION;

SILVER;

EID: 84935013445     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/acsami.5b02134     Document Type: Article

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