Recent progresses on hybrid micro–nano filler systems for electrically conductive adhesives (ECAs) applications

Journal of Materials Science: Materials in Electronics

Volumn 26, Issue 7, 2015, Pages 4730-4745

  Meschi Amoli, Behnam ^a,b   Hu, Anming ^c   Zhou, Norman Y ^a,b   Zhao, Boxin ^a,b  

^a UNIVERSITY OF WATERLOO   (Canada)

^b UNIVERSITY OF WATERLOO   (Canada)

^c University of Tennessee   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ELECTRIC CONDUCTIVITY; ELECTRONICS PACKAGING; PACKAGING MATERIALS; TOXIC MATERIALS;

ELECTRICAL CONDUCTIVITY; ELECTRICAL NETWORKS; ELECTRICAL PERFORMANCE; ELECTRICALLY CONDUCTIVE ADHESIVES; ELECTRON TRANSPORTATION; ELECTRONIC PACKAGING INDUSTRY; HIGH ELECTRICAL CONDUCTIVITY; NANO-SIZED CONDUCTIVE FILLERS;

FILLERS;

EID: 84931573363     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-015-3016-1     Document Type: Article

References (91)

1. Y. Li, C.P. Wong, Mater. Sci. Eng. R Rep. 51, 35 (2006)
2. C. Chen, L. Wang, R. Li, G. Jiang, H. Yu, T. Chen, J. Mater. Sci. 42, 3172 (2007)
3. H.J. Yun, K.H. Baek, L.M. Do, K.S. Jeong, Y.M. Kim, S.D. Yand, S.Y. Lee, H.Y. Lee, G.W. Lee, J. Nanosci. Nanotechnol. 13, 3313 (2013)
4. M. Layani, S. Magdassi, J. Mater. Chem. 21, 15378 (2011)
5. Y. Zemen, S.C. Schulz, H. Trommler, S.T. Buschhorn, W. Bauhofer, K. Schulte, Sol. Energy Mater. Sol. Cells 109, 155 (2013)
6. C. Yang, C.P. Wong, M.M.F. Yuen, J. Mater. Chem. C 1, 4052 (2013)
7. Y. Li, D. Lu, C.P. Wong, Electrical Conductive Adhesives with Nanotechnologies, 1st edn. (Springer, New York, 2010), pp. 1–19
8. S. Qi, R. Litchfield, D.A. Hutt, B. Vaidhyanathan, C. Liu, P. Webb, S. Ebbens, IEEE 62nd Electron. Compon. Technol. Conf. 1651–1655 (2012)
9. I.N. Kholmanov, S.H. Domingues, H. Chou, X. Wang, C. Tan, J.Y. Kim, H. Li, R. Piner, A.J.G. Zarbin, R.S. Ruoff, ACS Nano 7, 1811 (2013)
10. I. Halaciuga, J.I. Njagi, K. Redford, D.V. Goia, J. Colloid Interface Sci. 383, 215 (2012)
11. N. Hansen, D.O. Adams, K.L. DeVries, A. Goff, G. Hansen, J. Adhes. Sci. Technol. 25, 2659 (2011)
12. S. Bohm, E. Stammen, Microjoining and Nanojoining (Cambridge, England, 2008), p. 500
13. S. Nam, H.W. Cho, T. Kim, D. Kim, B.J. Sung, Appl. Phys. Lett. 99, 043104 (2011)
14. W. Jeong, H. Nishikawa, D. Itou, T. Takemoto, Mater. Trans. 46, 2276 (2005)
15. K.Y. Chun, Y. Oh, J. Rho, J.H. Ahn, Y.J. Kim, H.R. Choi, S. Baik, Nat. Nanotechnol. 5, 853 (2010)
16. Y. Tao, Y. Xia, H. Wang, F. Gong, H. Wu, G. Tao, IEEE Trans. Adv. Packag. 3, 2589 (2009)
17. R. Zhang, J.C. Agar, C.P. Wong, Proc. 12th Electron. Packag. Technol. 696–704 (2010)
18. B.M. Amoli, S. Gumfekar, A. Hu, N.Y. Zhou, B. Zhao, J. Mater. Chem. 22, 20048 (2012)
19. H. Jiang, K. Moon, Y. Li, C.P. Wong, Chem. Mater. 18, 2969 (2006)
20. M. Zulkarnain, M. Mariatti, I. Azid, J. Mater. Sci. Mater. Electron. 24, 1523 (2012)
21. Y. Oh, K.Y. Chun, E. Lee, Y.J. Kim, S. Baik, J. Mater. Chem. 20, 3579 (2010)
22. A. Mikrajuddin, F.G. Shi, S. Chungpaiboonpatana, K. Okuyama, C. Davidson, J.M. Adams, Mater. Sci. Semicond. Process. 2, 309 (1999)
23. A.J. Lovinger, J. Adhes. 10, 1 (1979)
24. H. Wu, X. Wu, M. Ge, G.Q. Zhang, Y.W. Wang, J.A. Jiang, Compos. Sci. Technol. 67, 1116 (2007)
25. T. Yu, Z.G. Yang, X.L. Lu, G.L. Tao, Y.P. Xia, H.P. Wu, Sci. China Technol. Sci. 55, 28 (2011)
26. J. Li, J.K. Lumpp, R. Andrews, D. Jacques, J. Adhes. Sci. Technol. 22, 1659 (2008)
27. L. Li, J.E. Morris, IEEE Trans. Compon. Packag. Manuf. Technol. Part A 20, 3 (1997)
28. C.A. Martin, J.K.W. Sandler, M.S.P. Shaffer, M.K. Schwarz, W. Bauhofer, K. Schulte, A.H. Windle, Compos. Sci. Technol. 64, 2309 (2004)
29. J. Li, P.C. Ma, W.S. Chow, C.K. To, B.Z. Tang, J.K. Kim, Adv. Funct. Mater. 17, 3207 (2007)
30. H. Jiang, K. Moon, J. Lu, J. Electron. Mater. 34, 1432 (2005)
31. G.R. Ruschau, S. Yoshikawa, R.E. Newnham, J. Appl. Phys. 72, 953 (1992)
32. M. Amjadi, A. Pichitpajongkit, S. Lee, S. Ryn, I. Park, ACS Nano 8, 5154 (2014)
33. N. Hu, Y. Karube, C. Yan, Z. Masuda, H. Fukunaga, Acta Mater. 56, 2929 (2008)
34. J.G. Simmons, J. Appl. Phys. 34, 1793 (1963)
35. D. Lu, Q.K. Tong, C.P. Wong, Int. Symp. Adv. Packag. Mater. 22, 365–371 (1999)
36. Y. Li, K. Moon, A. Whitman, C.P. Wong, IEEE Trans. Compon. Packag. Technol. 29, 758 (2006)
37. C. Yang, Y.T. Xie, M.M.F. Yuen, B. Xu, B. Gao, X. Xiong, C.P. Wong, Adv. Funct. Mater. 20, 2580 (2010)
38. C. Yang, W. Lin, Z. Li, R. Zhang, H. Wen, B. Gao, G. Chen, P. Gao, M.M.F. Yuen, C.P. Wong, Adv. Funct. Mater. 21, 4582 (2011)
39. C. Gallagher, G. Matijasevic, J.F. Maguire, IEEE Electron. Compon. Technol. Conf. 554–560 (1997)
40. B.M. Amoli, S.A. Ramazani, H. Izadi, J. Appl. Polym. Sci. 125, 453 (2012)
41. R. Zhang, K. Moon, W. Lin, C.P. Wong, J. Mater. Chem. 20, 2018 (2010)
42. F. Marcq, P. Demont, P. Monfraix, A. Peigney, C. Laurent, T. Falat, F. Courtade, T. Jamin, Microelectron. Reliab. 51, 1230 (2011)
43. H.L. Ma, H.B. Zhang, Q.H. Hu, W.J. Li, Z.G. Jiang, Z.Z. Yu, A.C.S. Appl, Mater. Interfaces 4, 1948 (2012)
44. H.W. Cui, A. Kowalczyk, D.S. Li, Q. Fan, Int. J. Adhes. Adhes. 44, 220 (2013)
45. Y. Long, J. Wu, H. Wang, X. Zhang, N. Zhao, J. Xu, J. Mater. Chem. 21, 4875 (2011)
46. H.H. Lee, K.S. Chou, Z.W. Shih, Int. J. Adhes. Adhes. 25, 437 (2005)
47. L. Fan, B. Su, J. Qu, C.P. Wong, Electron. Compon. Technol. Conf. 148–154 (2004)
48. P. Mach, R. Radev, A. Pietrikova, IEEE Electron. Syst. Technol. Conf. 1141–1146 (2008)
49. L. Ye, Z. Lai, J. Liu, IEEE Trans. Electron. Packag. Manuf. 22, 299 (1999)
50. H. Gao, L. Liu, Y. Luo, D. Jia, Mater. Lett. 65, 3529 (2011)
51. R. Zhang, W. Lin, K. Moon, C.P. Wong, ACS Appl. Mater. Interfaces 2, 2637 (2010)
52. R. Zhang, K. Moon, W. Lin, J.C. Agar, C.P. Wong, Compos. Sci. Technol. 71, 528 (2011)
53. A. Hu, J.Y. Guo, H. Alarifi, G. Patane, Y. Zhou, G. Compagnini, C.X. Xu, Appl. Phys. Lett. 97, 153117 (2010)
54. D. Wakuda, K. Kim, K. Suganuma, Scr. Mater. 59, 649 (2008)
55. S. Lai, J. Guo, V. Petrova, G. Ramanath, L.H. Allen, Phys. Rev. Lett. 77, 99 (1996)
56. B.J. Perelaer, A.W.M. de Laat, C.E. Hendriks, U.S. Schubert, J. Mater. Chem. 18, 3209 (2008)
57. Z.Z. Fang, H. Wang, Int. Mater. Rev. 53, 326 (2008)
58. J.G. Bai, T.G. Lei, J.N. Calata, G.Q. Lu, J. Mater. Res. 22, 3494 (2011)
59. P. Peng, A. Hu, H. Huang, A.P. Gerlich, B. Zhao, Y.N. Zhou, J. Mater. Chem. 22, 12997 (2012)
60. S. Magdassi, M. Grouchko, O. Berezin, A. Kamyshny, ACS Nano 4, 1943 (2010)
61. Y. Li, K. Moon, C.P. Wong, IEEE Electron. Compon. Technol. Conf. 29, 173 (2006)
62. L. Polavarapu, K.K. Manga, H.D. Cao, K.P. Loh, Q.H. Xu, Chem. Mater. 23, 3273 (2011)
63. T. Akter, W.S. Kim, ACS Appl. Mater. Interfaces 4, 1855 (2012)
64. H.P. Wu, J.F. Liu, X.J. Wu, M.Y. Ge, Y.W. Wang, G.Q. Zhang, J.Z. Jiang, Int. J. Adhes. Adhes. 26, 617 (2006)
65. Y.H. Yu, C.C.M. Ma, S.M. Yuen, C.C. Teng, Y.L. Huang, I. Wang, M.H. Wei, Macromol. Mater. Eng. 295, 1017 (2010)
66. D. Chen, X. Qiao, X. Qiu, F. Tan, J. Chen, R. Jiang, J. Mater. Sci. Mater. Electron. 21, 486 (2010)
67. Z. Zhang, X. Chen, H. Yang, H. Fu, F. Xiao, Int. Conf. Electron. Packag. Technol. High Density Packag. 107, 6826–6829 (2009)
68. M. Moskovits, J.S. Suh, J. Am. Chem. Soc. 107, 6826 (1985)
69. Z.X. Zhang, X.Y. Chen, F. Xiao, J. Adhes. Sci. Technol. 25, 1465 (2011)
70. X. Yang, W. He, S. Wang, G. Zhou, Y. Tang, J. Mater. Sci. Mater. Electron. 23, 108 (2011)
71. E. Marzbanrad, A. Hu, B. Zhao, Y. Zhou, J. Phys. Chem. C 117, 16665 (2013)
72. B.M. Amoli, E. Marzbanrad, A. Hu, Y.N. Zhou, B. Zhao, Macromol. Mater. Eng. 299, 739 (2014)
73. S. Iijima, Nature 354, 56 (1991)
74. K.S. Novoselov, A.K. Geim, S.V. Morozov, D. Jiang, M.I. Katsnelson, I.V. Grigorieva, S.V. Dubonos, A.A. Firsov, Nature 438, 197 (2005)
75. T.W. Odom, J. Huang, Nature 391, 1997 (1998)
76. D.D. Lu, Y.G. Li, C.P. Wong, J. Adhes. Sci. Technol. 22, 815 (2008)
77. E.E. Tkalya, M. Ghislandi, G. With, C.E. Koning, Curr. Opin. Colloid Interface Sci. 17, 225 (2012)
78. A. O’Neill, U. Khan, P.N. Nirmalraj, J. Boland, J.N. Coleman, J. Phys. Chem. C 115, 5422 (2011)
79. V.H. Pham, T.V. Cuong, S.H. Hur, E. Oh, E.J. Kim, E.W. Shin, J.S. Chung, J. Mater. Chem. 21, 3371 (2011)
80. V.H. Luan, H.N. Tien, T.V. Cuong, B.S. Kong, J.S. Chung, E.J. Kim, S.H. Hur, J. Mater. Chem. 22, 8649 (2012)
81. Y. Si, E.T. Samulski, Synthesis of water soluble graphene. Nano Lett. 8, 1679 (2008)
82. A.S. Wajid, H.S.T. Ahmed, S. Das, F. Irin, A.F. Jankowski, M.J. Green, Macromol. Mater. Eng. 298, 339 (2013)
83. L. Xuechun, L. Feng, in Proceedings of the Sixth IEEE CPMT Conference in High Density Microsystem Des. Packag. Compon. Fail. Anal. (HDP ‘04). IEEE (2004), pp. 382–384
84. H. Wu, X. Wu, M. Ge, G.Q. Zhang, Y.W. Wang, J. Jiang, Compos. Sci. Technol. 67, 1182 (2007)
85. Y. Oh, D. Suh, Y. Kim, E. Lee, J.S. Mok, J. Choi, S. Baik, Nanotechnology 19, 495602 (2008)
86. N.W. Pu, Y.Y. Peng, P.C. Wang, Carbon 67, 449 (2014)
87. X. Peng, F. Tan, W. Wang, X. Qiu, F. Sun, X. Qiao, J. Chen, J. Mater. Sci. Mater. Electron. 25, 1149 (2014)
88. K. Liu, S. Chen, Y. Luo, D. Jia, H. Gao, G. Hu, L. Liu, Compos. Sci. Technol. 94, 1 (2014)
89. K. Liu, L. Liu, Y. Luo, D. Jia, J. Mater. Chem. 22, 20342 (2012)
90. K. Liu, S. Chen, Y. Luo, D. Jia, H. Gao, G. Ju, L. Liu, Compos. Sci. Technol. 88, 84 (2013)
91. B.M. Amoli, J. Trinidad, A. Hu, Y.N. Zhou, B. Zhao, J. Mater. Sci. Mater. Electron. 26, 590 (2014)