Thermal fatigue of Ag flake sintering die-attachment for Si/SiC power devices

Journal of Materials Science: Materials in Electronics

Volumn 24, Issue 7, 2013, Pages 2593-2601

  Sakamoto, Soichi ^a   Nagao, Shijo ^a   Suganuma, Katsuaki ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH TEMPERATURE CONDITION; INTERFACIAL DEBONDING; JOINING STRENGTH; LOW TEMPERATURES; OPERATING ENVIRONMENT; POWER SEMICONDUCTOR DEVICES; THERMAL CYCLE; THERMOMECHANICAL RELIABILITY;

DEBONDING; ELECTRIC EQUIPMENT; HIGH TEMPERATURE OPERATIONS; JOINING; SILICON; SILICON CARBIDE; SILICON WAFERS; SILVER; SINTERING;

DIES;

EID: 84879422596     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-013-1138-x     Document Type: Article

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