SCOPUS 정보 검색 플랫폼

Volumn 128, Issue , 2014, Pages 42-45

Pressureless sintering of nanosilver paste at low temperature to join large area (≥100 mm2) power chips for electronic packaging

(6) Fu, Shancan a Mei, Yunhui a Lu, Guo Quan a,b Li, Xin a Chen, Gang a Chen, Xu a

a TIANJIN UNIVERSITY (China)

b Virginia Polytechnic Institute and State University (United States)

Author keywords

Die attachment; Diffusion bonding; Microstructures; Pressureless sintering; Silver nanoparticles

Indexed keywords

CHIP SCALE PACKAGES; DIFFUSION BONDING; METAL NANOPARTICLES; MICROSTRUCTURE; PARTICLE SIZE; SINTERING; TEMPERATURE; THERMAL CONDUCTIVITY;

DIE ATTACHMENT; ELECTRONIC PACKAGING; HIGH THERMAL CONDUCTIVITY; LOW TEMPERATURES; MICRO-PARTICLES; NANO-SILVER PASTES; PRESSURE-LESS SINTERING; SILVER PARTICLES;

SILVER NANOPARTICLES;

EID: 84900030843 PISSN: 0167577X EISSN: None Source Type: Journal
DOI: 10.1016/j.matlet.2014.04.127 Document Type: Article

Times cited : (111)

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