Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging

Microelectronics Reliability

Volumn 53, Issue 4, 2013, Pages 645-651

  Chen, Gang ^a   Zhang, Ze Sheng ^a   Mei, Yun Hui ^a   Li, Xin ^a   Lu, Guo Quan ^b   Chen, Xu ^a  

^a TIANJIN UNIVERSITY   (China)

^b Virginia Polytechnic Institute and State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CYCLIC SHEAR; DETECTING SYSTEMS; FORCE AMPLITUDE; NONLINEAR KINEMATIC HARDENING; ROOM TEMPERATURE; SANDWICHED STRUCTURE; TESTING APPARATUS; VISCOPLASTIC;

ELECTRONICS PACKAGING; EXPERIMENTS; POWER ELECTRONICS; SHEAR FLOW;

SINTERING;

EID: 84875518618     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2012.11.011     Document Type: Article

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