Reinforcement of Ag nanoparticle paste with nanowires for low temperature pressureless bonding

Journal of Materials Science

Volumn 47, Issue 19, 2012, Pages 6801-6811

  Peng, Peng ^a,b   Hu, Anming ^a   Zhao, Boxin ^a,b   Gerlich, Adrian P ^a   Zhou, Y Norman ^a,b  

^a UNIVERSITY OF WATERLOO   (Canada)

^b UNIVERSITY OF WATERLOO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

AG NANOPARTICLE; AG NANOWIRES; BONDED JOINT; BONDING STRENGTH; BONDING TECHNOLOGY; COPPER NANOPARTICLES; COPPER WIRES; ELECTRONIC PACKAGING; FRACTURE PATH; LEAD-FREE; LOW TEMPERATURES; LOW-TEMPERATURE SINTERING; MECHANICAL REINFORCEMENT; METALLIC BONDING; NANOMATERIAL; PRESSURELESS; SILVER NANOPARTICLES; SOLID STATE SINTERING;

ELECTRONICS PACKAGING; FRACTURE; INDUSTRIAL APPLICATIONS; LOADING; NANOPARTICLES; NANOSTRUCTURED MATERIALS; NANOWIRES; REINFORCEMENT; SINTERING; TEMPERATURE;

SILVER;

EID: 84864760292     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-012-6624-7     Document Type: Article

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