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Journal of Electronic Materials

Volumn 38, Issue 12, 2009, Pages 2720-2725

Investigation of gold nanoparticle inks for low-temperature lead-free packaging technology

(2) Bakhishev, Teymur a Subramanian, Vivek a

a UNIVERSITY OF CALIFORNIA (United States)

Author keywords

Electromigration; Electronics packaging; Lead free; Low temperature; Nanoparticle solder

Indexed keywords

BLACK'S EQUATION; BOUNDARY DIFFUSION; BULK-LIKE; GOLD NANOPARTICLE INK; HOMOLOGOUS TEMPERATURE; LEAD FREE SOLDERS; LEAD-FREE; LOW TEMPERATURE; LOW TEMPERATURES; METALLIC STRUCTURES; PACKAGING APPLICATIONS; PACKAGING TECHNOLOGIES; RESULTING MATERIALS; SN-AG-CU; TIME TO FAILURE;

ACTIVATION ENERGY; COMPUTER CRIME; DISSOLUTION; ELECTROMIGRATION; ELECTRONICS PACKAGING; FILMS; GOLD; INK; LEAD; NANOPARTICLES; PACKAGING; SINTERING; SOLDERING ALLOYS; SURFACE ACTIVE AGENTS; TIN;

SILVER;

EID: 72549104581 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0918-9 Document Type: Article

Times cited : (60)

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