Thermoelectric coolers with sintered silver interconnects

Journal of Electronic Materials

Volumn 43, Issue 6, 2014, Pages 2397-2404

  Kähler, Julian ^a   Stranz, Andrej ^a   Waag, Andreas ^a   Peiner, Erwin ^a  

^a TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

Author keywords

bottom hole assembly; high temperature operation; measurement while drilling; Peltier cooler; Silver sintering; temperature cycling capability

Indexed keywords

BOTTOM-HOLE ASSEMBLY; COOLING SYSTEMS; HIGH TEMPERATURE OPERATIONS; INTEGRATED CIRCUIT INTERCONNECTS; PELLETIZING; SILVER; SINTERING; THERMOELECTRIC EQUIPMENT;

HIGH TEMPERATURE SOLDERS; MEASUREMENT WHILE DRILLINGS; OPERATING TEMPERATURE RANGES; PELTIER COOLERS; POSITIONING ACCURACY; SPECIFIC CONTACT RESISTANCES; TEMPERATURE CYCLING; THERMOELECTRIC COOLER;

BISMUTH COMPOUNDS;

EID: 84901923368     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-014-3078-5     Document Type: Article

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