A low-temperature bonding process using mixed Cu-Ag nanoparticles

Journal of Electronic Materials

Volumn 39, Issue 8, 2010, Pages 1283-1288

  Morisada, Y ^a   Nagaoka, T ^a   Fukusumi, M ^a   Kashiwagi, Y ^a   Yamamoto, M ^a   Nakamoto, M ^a  

^a OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE   (Japan)

Author keywords

Ag nanoparticles; Bonding process; Bonding strength; Cu particles; Ionic migration resistance

Indexed keywords

AG NANOPARTICLE; BONDING PROCESS; BONDING STRENGTH; COUNTER ELECTRODES; CU NANOPARTICLES; HIGH STRENGTH; IONIC MIGRATION; LOW-TEMPERATURE BONDING PROCESS;

BONDING; DIFFUSION BONDING; IONIC STRENGTH; NANOPARTICLES;

SILVER;

EID: 77954625029     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-010-1195-3     Document Type: Article

References (19)

1. A.N. Goldstem, C.M. Esher, and A.P. Alivisatos, Science 256, 1425 (1992).
2. L.N. Lewis, Chem. Rev. 93, 2693 (1993).
3. M.T. Reetz, W. Helbig, S.A. Quaiser, U. Stimming, N. Breuer, and R. Vogel, Science 267, 367 (1995).
4. J.S. Bradley, B. Teshe, W. Busser, M. Maase, and M.T. Reets, J. Am. Chem. Soc. 122, 4631 (2000).
5. S.H. Sun, C.B. Murray, D. Weller, L. Folks, and A. Moser, Science 287, 1989 (2000).
6. M.B. Thathagar, J. Beckers, and G. Rothenberg, J. Am. Chem. Soc. 124, 11858 (2002).
7. T.K. Sau, A. Pal, and T. Pal, J. Phys. Chem. B 105, 9266 (2001).
8. C.P. Collier, R.J. Saykally, J.J. Shiang, S.E. Henrichs, J.R. Heath, and J.M. Gibson, Science 277, 1978 (1997).
9. H. Kats, Z. Bao, and S. Gilat, Acc. Chem. Res. 34, 359 (2001).
10. C.D. Dimitrakopoulos and P.R.L. Malenfant, Adv. Mater. 14, 99 (2002).
11. R.F. Service, Science 281, 940 (1998).
12. K. Kurihara, J. Kizling, P. Stenius, and J.H. Fendler, J. Am. Chem. Soc. 105, 2574 (1983).
13. N. Toshima and Y. Wang, Langmuir 10, 4574 (1994).
14. Y. Kashiwagi, M. Yamamoto, and M. Nakamoto, J. Colloid Interface Sci. 300, 169 (2006).
15. M. Yamamoto and M. Nakamoto, J. Mater. Chem. 13, 2064 (2003).
16. M. Yamamoto, Y. Kashiwagi, and M. Nakamoto, Langmuir 22, 8581 (2006).
17. M. Nakamoto, M. Yamamoto, and Y. Kashiwagi, Metal Nanoclusters in Catalysis and Materials Science-The Issue of Size Control, ed. B. Corain, G. Schmid, and N. Toshima (Elsevier, Amsterdam, 2008), pp. 367-372.
18. E. Ide, S. Angata, A. Hirose, and K.F. Kobayashi, Acta Mater. 53, 2385 (2005).
19. T. Nagaoka, Y. Morisada, M. Fukusumi, Y. Kashiwagi, M. Yamamoto, M. Nakamoto, Y. Yoshida, H. Kakiuchi, and S. Matsumura, Proceeding of 14th Symposium on "Microjoining and Assembly Technology in Electronics" (Yokohama, Japan, February 2008), pp. 191-194.