Characterization and reliability of sintered nanosilver joints by a rapid current-assisted method for power electronics packaging

IEEE Transactions on Device and Materials Reliability

Volumn 14, Issue 1, 2014, Pages 262-267

  Mei, Yun Hui ^a   Cao, Yunjiao ^a   Chen, Gang ^a   Li, Xin ^a   Lu, Guo Quan ^b   Chen, Xu ^a  

^a TIANJIN UNIVERSITY   (China)

^b Virginia Polytechnic Institute and State University   (United States)

Author keywords

Copper; cycling; hardness; microstructures; shear strength; Silver nanoparticles

Indexed keywords

COPPER; DIFFUSION BONDING; ELECTRONICS PACKAGING; HARDNESS; HOT PRESSING; MICROSTRUCTURE; POWER ELECTRONICS; PROTECTIVE ATMOSPHERES; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SILVER;

ALTERNATING CURRENT; BONDING MATERIALS; CURRENT DIRECTION; CYCLING; HARDNESS MEASUREMENT; NANO-SILVER PASTES; POWER ELECTRONIC APPLICATIONS; SILVER NANOPARTICLES;

SINTERING;

EID: 84896448000     PISSN: 15304388     EISSN: 15582574     Source Type: Journal    
DOI: 10.1109/TDMR.2013.2278979     Document Type: Article

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