Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid

Materials Science and Engineering: A

Volumn 613, Issue , 2014, Pages 372-378

  Li, Wen Hua ^a   Lin, Pei Syuan ^a   Chen, Chen Ni ^a   Dong, Teng Yuan ^a   Tsai, Chi Hang ^b   Kung, Wan Ting ^c   Song, Jenn Ming ^c   Chiu, Ying Ta ^d   Yang, Ping Feng ^d  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^c NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

^d ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Bonding material; Copper to copper bonding; Interconnection; Nanoparticles; Silver

Indexed keywords

ELECTRONICS PACKAGING; FATTY ACIDS; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; INTERFACES (MATERIALS); SCANNING ELECTRON MICROSCOPY; SILVER NANOPARTICLES;

BONDING MATERIALS; COPPER SUBSTRATES; COPPER-TO-COPPER BONDING; DODECANOIC ACID; ELECTRONIC PACKAGING; HIGH-RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; INTERCONNECTION; LOWS-TEMPERATURES; SHEARS STRENGTH; THIN LAYERS;

TEMPERATURE;

EID: 84904754934     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2014.07.002     Document Type: Article

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