Welding of gold nanowires with different joining procedures

Journal of Nanoparticle Research

Volumn 14, Issue 2, 2012, Pages

  Guo, J Y ^a,b   Xu, C X ^a   Hu, A M ^c   Shi, Z L ^a   Sheng, F Y ^a   Dai, J ^a,b   Li, Z H ^a,b  

^a SOUTHEAST UNIVERSITY   (China)

^b JIANGSU UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^c UNIVERSITY OF WATERLOO   (Canada)

Author keywords

Common neighbor analysis; Modeling and simulation; Monte Carlo; Nanoscale assembling; Nanowire; Welding

Indexed keywords

ANALYSIS TECHNIQUES; ATOMIC MOBILITY; BONDING STRENGTH; BOTTOM-UP FABRICATION; COMMON NEIGHBOR ANALYSIS; CONTACTING ANGLE; FREE END; GOLD NANOWIRE; HIGH TEMPERATURE; JOINT STRUCTURE; LOW TEMPERATURES; MANY-BODY POTENTIALS; METAL INTERACTIONS; METALLIC NANOWIRES; MODELING AND SIMULATION; MOLTEN PHASE; MONTE CARLO; MONTE CARLO SIMULATION; NANO SCALE; NANO-DEVICES;

COMPUTER SIMULATION; GOLD; JOINING; METAL ANALYSIS; MONTE CARLO METHODS; NANOWIRES;

WELDING;

GOLD; NANOWIRE;

ARTICLE; HIGH TEMPERATURE; LOW TEMPERATURE; MONTE CARLO METHOD; NANODEVICE; NANOFABRICATION; PRIORITY JOURNAL; QUANTUM CHEMISTRY; STRENGTH; WELDING;

EID: 84863131144     PISSN: 13880764     EISSN: 1572896X     Source Type: Journal    
DOI: 10.1007/s11051-011-0666-7     Document Type: Article

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