Uniaxial ratcheting behavior of sintered nanosilver joint for electronic packaging

Materials Science and Engineering: A

Volumn 591, Issue , 2014, Pages 121-129

  Chen, Gang ^a   Yu, Lin ^a   Mei, Yunhui ^a,b   Li, Xin ^a,b   Chen, Xu ^a   Lu, Guo Quan ^a,c  

^a TIANJIN UNIVERSITY   (China)

^b TIANJIN KEY LABORATORY OF ADVANCED JOINING TECHNOLOGY   (China)

^c VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

Cycling; Die attachment; Fatigue; Microstructure; Reliability; Shear

Indexed keywords

ELECTRONICS PACKAGING; SINTERING; STRAIN RATE;

CYCLING; DIE ATTACHMENT; MEAN STRESS; NANO SILVER; RATE RATIOS; SHEAR; SINTERED JOINT; STRESS AMPLITUDES; STRESS RATES; STRESS RATIO;

FATIGUE OF MATERIALS;

EID: 84887580809     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2013.10.091     Document Type: Article

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