Power semiconductor joining through sintering of silver nanoparticles: Evaluation of influence of parameters time, temperature and pressure on density, strength and reliability

2010 6th International Conference on Integrated Power Electronics Systems, CIPS 2010

Volumn , Issue , 2011, Pages

  Knoerr, Matthias ^a   Schletz, Andreas ^a  

^a FRAUNHOFER INSTITUTE FOR INTEGRATED SYSTEMS AND DEVICE TECHNOLOGY IISB   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CALORIMETRIC ANALYSIS; CERAMIC SUBSTRATES; DENSITY MEASUREMENTS; DIE BONDING; DUMMY CHIPS; ELECTRONIC MICROSCOPES; HEALTH REGULATIONS; HIGH PRESSURE; INTERCONNECTION LAYERS; INTERCONNECTION TECHNOLOGY; LASER PROFILOMETERS; NANO SILVER; ORGANICS; POWER ELECTRONIC DEVICES; POWER SEMICONDUCTORS; REAL INTEREST; SHEAR TESTS; SILVER NANOPARTICLES; SILVER PARTICLES; SINTERING CHARACTERISTICS; SINTERING PROPERTIES; SINTERING TIME; SOLDER ALLOYS;

LAWS AND LEGISLATION; NANOPARTICLES; ORGANIC POLYMERS; OXYGEN; POWER ELECTRONICS; SHEAR STRENGTH; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS;

SINTERING;

EID: 79953743999     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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