Low-temperature sintering with nano-silver paste in die-attached interconnection

Journal of Electronic Materials

Volumn 36, Issue 10, 2007, Pages 1333-1340

  Wang, Tao ^a   Chen, Xu ^a   Lu, Guo Quan ^b   Lei, Guang Yin ^b  

^a TIANJIN UNIVERSITY   (China)

^b State University   (United States)

Author keywords

Electronic packaging; Lead free; Low temperature sintering; Nano silver paste

Indexed keywords

LEAD FREE; LOW TEMPERATURE SINTERING; NANO SILVER PASTE;

ENERGY GAP; GRAVIMETRIC ANALYSIS; LOW TEMPERATURE EFFECTS; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICES; SILVER; SINTERING; VAPORIZATION;

CHIP SCALE PACKAGES;

EID: 34848862467     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0230-5     Document Type: Article

References (19)

1. M. Trivedi and K. Shenai, Proc. Int. Workshop on Integrated Power Packaging (Waltham, MA, IWIPP, 2000), pp. 17-20.
2. R. Singh, A.R. Hefner, D. Berning, and J.W. Palmour, Proc. 13th Int. Symposium on Power Semiconductor Devices and ICs (Osaka, Japan, ISPSD, 2001), pp. 45-48.
3. H. Xing, et al. J. Phys. Condens. Matter. 13, 7139 (2001).
4. D.C. Katsis and J.D. Wyk, IEEE Trans. Ind. Appl. 39, 1239 (2003).
5. H.K. Kim, H.K. Liou, and K.N. Tu, Appl. Phys. Lett. 66, 2337 (1995).
6. C.H. Crane, D.T. Lovell, W.A. Baginski, and M.G. Olsen, Welding Res. Suppl. 46, 23 (1967).
7. M. O'Brien, C.H. Rice, and D.L. Olson, Welding J. 55, 25 (1976).
8. H. Schwarzbauer and R. Kuhnert, IEEE Trans. Ind. Appl. 27, 93 (1991).
9. H. Schwarzbauer, U.S. patent 4,810,672 (3 March 1989).
10. Z.Y. Zhang and G.Q. Lu, IEEE Trans. Electron. Packaging Manuf. 25, 279 (2002).
11. W.W. Kwan, V. Kripesh, M.K. Iyer, et al., Electronics Packaging Technology 5th Conference (Singapore, EPTC, 2003), pp. 551-556.
12. C. Herring, J. Appl. Phys. 21, 301 (1950).
13. G.Q. Lu, J.N. Calata, Z.Y. Zhang, and J.G. Bai, Proc. 6th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (Shanghai: IEEE Press, 2004), pp. 42-46.
14. Z.Y. Zhang, J.N. Calata, C. Suchicital, G.Q. Lu, and D.P.H. Hasselman, The 9th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Las Vegas, NV: IEEE Press, 2004), pp. 45-49.
15. K.S. Moon, H. Dong, R. Maric, S. Pothukuchi, A. Hunt, Y. Li, C.P. Wong, J. Electron. Mater. 43, 168 (2005).
16. S.B. Rane, T. Seth, G.J. Phatak, D.P. Amalnerkar, and B.K. Das, Mater. Lett. 57, 3096 (2003).
17. The Websites of IXYS Corporation, www.ixys.com. Accessed 20 August 2007.
18. Y.C. Lin, J.H. Jean, J. Am. Ceram. Soc. 87, 187 (2004).
19. V.A. Ivensen, Densification of Metal Powders during Sintering (New York/London: Consultants Bureau, 1973).