Fabrication of interconnects using pressureless low temperature sintered Ag nanoparticles

Materials Letters

Volumn 85, Issue , 2012, Pages 61-63

  Wang, Shuai ^a   Ji, Hongjun ^a   Li, Mingyu ^a   Wang, Chunqing ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Ag nanoparticle; Interconnects; Recrystallization; Sintering; Thermal conductivity

Indexed keywords

AG NANOPARTICLE; BONDING TEMPERATURES; ELECTRONIC PACKAGING; FABRICATION PROCESS; LOW TEMPERATURES; LOW-TEMPERATURE SINTERING; ORGANIC SHELLS; PRESSURELESS; SHEAR STRENGTH OF JOINT; SINTERING PROCESS;

CHEMICAL BONDS; CRYSTALLIZATION; ELECTRONICS PACKAGING; MORPHOLOGY; NANOPARTICLES; OPTICAL INTERCONNECTS; RECRYSTALLIZATION (METALLURGY); SHELLS (STRUCTURES); SINTERING; TEMPERATURE; THERMAL CONDUCTIVITY;

SILVER;

EID: 84865086481     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2012.06.089     Document Type: Article

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