Reliability comparison between SAC305 joint and sintered nanosilver joint at high temperatures for power electronic packaging

Journal of Materials Processing Technology

Volumn 214, Issue 9, 2014, Pages 1900-1908

  Chen, Gang ^a   Yu, Lin ^a   Mei, Yun Hui ^a   Li, Xin ^a   Chen, Xu ^a   Lu, Guo Quan ^a,b  

^a TIANJIN UNIVERSITY   (China)

^b Virginia Polytechnic Institute and State University   (United States)

Author keywords

Die attachment; Fatigue; Nanosilver; Non contact; Ratcheting; SAC305

Indexed keywords

ELECTRONICS PACKAGING; SHEARING; SINTERING;

DIE ATTACHMENT; NANO SILVER; NON-CONTACT; RATCHETING; SAC305;

FATIGUE OF MATERIALS;

EID: 84899668223     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2014.04.007     Document Type: Article

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