Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 25, Issue 4, 2002, Pages 279-283

  Zhang, Zhiye Zach ^a   Lu, Guo Quan ^a  

^a State University   (United States)

Author keywords

Fatigue failure; Junction; Quasihydrostatic pressure; Silver paste

Indexed keywords

ADHESIVE PASTES; ELECTRIC CONDUCTIVITY; FATIGUE OF MATERIALS; HYDROSTATIC PRESSURE; LOW TEMPERATURE OPERATIONS; PRESSURE EFFECTS; SEMICONDUCTOR JUNCTIONS; SILVER; SINTERING; THERMAL CONDUCTIVITY; THERMAL EFFECTS; WELDS;

FATIGUE FAILURE; PRESSURE-ASSISTED LOW-TEMPERATURE SINTERING; QUASIHYDROSTATIC PRESSURE; SILVER PASTE; SOLDER REFLOW;

ELECTRONICS PACKAGING;

EID: 0036826433     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2002.807719     Document Type: Article

References (9)

1. N. Zhu, "Thermal impact of solder voids in the electronic packaging of power devices," in Proc. 15th Annu. IEEE SEMI-THERM Symp., San Diego, CA, 1999, pp. 22-29.
2. D. C. Katsis and J. D. van Wyk, "Void induced thermal impedance in power semiconductor modules: Some transient temperature effects," in Proc. 36th IAS Annu. Meeting Ind. Applicat. Conf., vol. 3, 2001, pp. 1905-1911.
3. E. R. Brown and M. C. Shaw, "Thermomechatronics of power electronic packages," in Proc. IEEE ITHERM Conf., Las Vegas, NV, May.
4. H. Schwarzhauer, "Novel large area joining technique for improved power device performance," IEEE Trans. Ind. Applicat., vol. 27, pp. 93-95, Jan./Feb. 1991.
5. ____, "Method of Securing Electronic Components to a Substrate," U.S. Patent 4 810 672.
6. R. Kuhnert and H. Schwarzbauer, "A novel packaging technology for large area IC-power devices," in Proc. S. Cal-ISHM Symp., Anaheim, CA, Apr. 1989.
7. S. Klaka and R. Sitting, "Reduction of thermo-mechanical stress by applying a low temperature joining technique," in Proc. 6th Int. Symp. Power Semiconductor Devices ICs, Mar. 1994, pp. 259-264.
8. U. Scheuermann et al., "Low temperature joining technology-A high reliability alternative to solder contacts," in Workshop Metal Ceramic Composites Functional Applicat., Vienna, Austria, June.
9. W. J. Parker et al., "Flash method of determining thermal diffusivity, heat capacity, and thermal conductivity," J. Appl. Phys., vol. 32, no. 9, p. 1679, 1961.