Effect of PVP on the low temperature bonding process using polyol prepared Ag nanoparticle paste for electronic packaging application

Journal of Physics: Conference Series

Volumn 379, Issue 1, 2012, Pages

  Yan, Jianfeng ^a   Zou, Guisheng ^a   Wu, Aiping ^a   Ren, Jialie ^a   Yan, Jiuchun ^b   Hu, Anming ^c   Liu, Lei ^c   Norman Zhou, Y ^a,c  

^a TSINGHUA UNIVERSITY   (China)

^b HARBIN INSTITUTE OF TECHNOLOGY   (China)

^c UNIVERSITY OF WATERLOO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ALCOHOLS; BONDING; ELECTRONICS PACKAGING; INNOVATION; LOW TEMPERATURE OPERATIONS; METAL NANOPARTICLES; NANOPARTICLES; SUSTAINABLE DEVELOPMENT; SYNTHESIS (CHEMICAL); TEMPERATURE;

AG NANOPARTICLE; ELECTRONIC PACKAGING APPLICATIONS; LOW TEMPERATURES; LOW-TEMPERATURE BONDING PROCESS; NANOPARTICLE SOLUTIONS; POLYVINYL PYRROLIDONE; PROTECTING AGENT; SILVER NANOPARTICLES;

SILVER;

EID: 84867962351     PISSN: 17426588     EISSN: 17426596     Source Type: Conference Proceeding    
DOI: 10.1088/1742-6596/379/1/012024     Document Type: Conference Paper

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