Pressure free sintering of silver nanoparticles to silver substrate using weakly binding ligands

Proceedings of the IEEE Conference on Nanotechnology

Volumn , Issue , 2012, Pages

  Durairaj, Rajkumar ^a   Ashayer, Roya ^b,d   Kotadia, Hiren R ^c,d   Haria, Neil ^d   Lorenz, Chris ^d   Mokhtari, Omid ^d,e   Mannan, Samjid H ^d  

^a UNIVERSITI TUNKU ABDUL RAHMAN   (Malaysia)

^b NATIONAL PHYSICAL LABORATORY   (United Kingdom)

^c BRUNEL UNIVERSITY   (United Kingdom)

^d KING'S COLLEGE LONDON   (United Kingdom)

^e OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE SYSTEMS; AG NANOPARTICLE; AG PARTICLES; AG SUBSTRATE; BINDING LIGANDS; LOW HOMOLOGOUS TEMPERATURES; MOLECULAR DYNAMICS SIMULATIONS; PLANAR SUBSTRATE; SILVER NANOPARTICLES; SILVER SUBSTRATE; THEORETICAL LIMITS;

LIGANDS; MOLECULAR DYNAMICS; NANOPARTICLES; NANOTECHNOLOGY; SINTERING; SUBSTRATES;

SILVER;

EID: 84869196811     PISSN: 19449399     EISSN: 19449380     Source Type: Conference Proceeding    
DOI: 10.1109/NANO.2012.6321890     Document Type: Conference Paper

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