Rapid sintering nanosilver joint by pulse current for power electronics packaging

IEEE Transactions on Device and Materials Reliability

Volumn 13, Issue 1, 2013, Pages 258-265

  Mei, Yunhui ^a   Cao, Yunjiao ^a   Chen, Gang ^a   Li, Xin ^a   Lu, Guo Quan ^b   Chen, Xu ^a  

^a TIANJIN UNIVERSITY   (China)

^b Virginia Polytechnic Institute and State University   (United States)

Author keywords

Current sintering; lead free; low temperature sintering; nanosilver paste; rapid joining

Indexed keywords

CONVENTIONAL HEATING METHODS; CURRENT SINTERING; JOINT MICROSTRUCTURES; LEAD-FREE; LOW-TEMPERATURE SINTERING; NANO-SILVER PASTES; POWER ELECTRONICS MODULES; SINTERING TEMPERATURES;

BONDING; COPPER; ELECTRONICS PACKAGING; JOINING; ORGANIC SOLVENTS; POWER ELECTRONICS; SCANNING ELECTRON MICROSCOPY;

SINTERING;

EID: 84874951593     PISSN: 15304388     EISSN: 15582574     Source Type: Journal    
DOI: 10.1109/TDMR.2012.2237552     Document Type: Article

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