Mechanism of migration of sintered nanosilver at high temperatures in dry air for electronic packaging

IEEE Transactions on Device and Materials Reliability

Volumn 14, Issue 1, 2014, Pages 311-317

  Lu, Guo Quan ^a,b   Yang, Wen ^a   Mei, Yun Hui ^a   Li, Xin ^a   Chen, Gang ^a   Chen, Xu ^a  

^a TIANJIN UNIVERSITY   (China)

^b Virginia Polytechnic Institute and State University   (United States)

Author keywords

Dendrites; Discrete silver particles; higherature biased testing; nanosilver based electrodes; power electronics

Indexed keywords

DENDRITES (METALLOGRAPHY); ELECTRONICS PACKAGING; POWER ELECTRONICS; SINTERED ALUMINA; SINTERING;

ALUMINA PARTICLES; ALUMINA SUBSTRATES; ELECTRONIC PACKAGING; POSSIBLE MECHANISMS; POWER ELECTRONIC DEVICES; RELIABILITY EVALUATION; SEMICONDUCTOR CHIPS; SILVER PARTICLES;

SILVER;

EID: 84896471839     PISSN: 15304388     EISSN: 15582574     Source Type: Journal    
DOI: 10.1109/TDMR.2013.2282041     Document Type: Article

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