Sintering of copper particles for die attach

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 10, 2012, Pages 1587-1591

  Kähler, Julian ^a   Heuck, Nicolas ^a,b   Wagner, Alexander ^a   Stranz, Andrej ^a   Peiner, Erwin ^a   Waag, Andreas ^a  

^a TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

Copper; electronics packaging; nanoparticles; semiconductor device packaging

Indexed keywords

COPPER PARTICLES; COPPER PASTE; DEEP DRILLING; FEASIBILITY ANALYSIS; POWER ELECTRONIC MODULES; SEMICONDUCTOR DEVICE PACKAGING; SHEAR TESTS; YOUNG'S MODULUS;

COPPER; ELECTRONICS PACKAGING; NANOPARTICLES; THERMAL CONDUCTIVITY;

SINTERING;

EID: 84867220257     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2201940     Document Type: Article

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