Contactless electrical sintering of silver nanoparticles on flexible substrates

IEEE Transactions on Microwave Theory and Techniques

Volumn 59, Issue 5, 2011, Pages 1419-1429

  Allen, Mark ^a,b   Alastalo, Ari ^a   Suhonen, Mika ^a   Mattila, Tomi ^a   Leppäniemi, Jaakko ^a   Seppä, Heikki ^a  

^a VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

^b AALTO UNIVERSITY   (Finland)

Author keywords

Flexible substrate; impedance matching; inkjet printing; nanoparticle ink; near field coupling; rapid electrical sintering (RES)

Indexed keywords

1.8 GHZ; AIR-GAPS; BIASING CONDITIONS; CONTACT LESS; ELECTRIC FIELD PATTERNS; ELECTRODE SPACING; FLEXIBLE SUBSTRATE; HIGH-POWER; IMPEDANCE MATCHING; INPUT POWER; MICROWAVE POWER; NANOPARTICLE LAYERS; NEAR-FIELD; NEAR-FIELD COUPLING; POWER DELIVERY; PRINTED ELECTRONICS; PROCESSING SPEED; RAPID ELECTRICAL SINTERING (RES); REAL TIME MONITORING; REFLECTED POWER; SILVER NANOPARTICLES; TEMPERATURE-SENSITIVE; WORKING DISTANCES;

DIGITAL INTEGRATED CIRCUITS; ELECTRIC FIELDS; ELECTRIC POWER TRANSMISSION; INK; NANOPARTICLES; PRINTED CIRCUIT BOARDS; SILVER; SUBSTRATES;

SINTERING;

EID: 79955946960     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2011.2123910     Document Type: Conference Paper

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