Migration issues in sintered-silver die attaches operating at high temperature

Microelectronics Reliability

Volumn 53, Issue 9-11, 2013, Pages 1592-1596

  Riva, R ^a   Buttay, C ^a   Allard, B ^a   Bevilacqua, P ^a  

^a UNIVERSITÉ DE LYON   (France)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH MELTING POINT; HIGH TEMPERATURE; PARYLENES; PROTECTIVE EFFECTS; SILVER MIGRATION; THERMAL AND ELECTRICAL PROPERTIES; THIN LAYERS;

ELECTRIC FIELDS; ELECTRIC PROPERTIES; SINTERING;

SILVER;

EID: 84886912168     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2013.07.103     Document Type: Conference Paper

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