Study of bonding technology using silver nanoparticles

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 47, Issue 8 PART 1, 2008, Pages 6615-6622

  Morita, Toshiaki ^a   Ide, Eiichi ^a   Yasuda, Yusuke ^a   Hirose, Akio ^b   Kobayashi, Kojiro ^b,c  

^a HITACHI LTD   (Japan)

^b OSAKA UNIVERSITY   (Japan)

^c FUKUI UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

Bonding; Heat resistance; Nanoparticle; Silver; Thermal diffusion

Indexed keywords

HEAT RESISTANCE; LEAD; NANOPARTICLES; NANOSTRUCTURED MATERIALS; NANOSTRUCTURES; ORGANIC POLYMERS; SILICON; SILICON CARBIDE; TIN;

BONDING STRENGTHS; BONDING TECHNIQUES; BONDING TECHNOLOGIES; DISCHARGE CHARACTERISTICS; HIGH TEMPERATURES; SILVER NANOPARTICLES; SOLDER BONDS;

SILVER;

EID: 55149111616     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.47.6615     Document Type: Article

References (8)

1. Saishin Power Device Module to Kanren Shijo no Genjo to Syoraitenbo 2007 (The Newest Investigation Report of Power Device Module and a Relevant Market, and a Future View 2007) (Japan Marketing Survey, Tokyo, 2007) p. 92 [in Japanese].
2. M. Takagi: J. Phys. Soc. Jpn. 9 (1954) 359.
3. J. R. Groza and R. J. Dowding: Nanostruct. Mater. 7 (1996) 749.
4. G. L. Allen, R. A. Bayles, W. W. Gile, and W. A. Jesser: Thin Solid Films 144 (1986) 297.
5. E. Ide, S. Angata, A. Hirose, and K. F. Kobayashi: Proc. 13th Microelectronics Symp., 2003, p. 96 [in Japanese].
6. A. Hirose, E. ide, and K. F. Kobayashi: Electronics Jisso Gakkaishi 7 (2004) 511 [in Japanese].
7. E. Ide, S. Angata, A. Hirose, and K. F. Kobayashi: Proc. Int. Conf. New Frontiers of Process Science and Engineering in Advanced Materials (PSEA '04, 14th Iketani Conf.), Part 2, 2004, p. 233.
8. A. Sawatskii and F. E. Jaumot: Trans. Metall. Soc. AIME 209 (1957) 1207.