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Journal of Materials Chemistry C

Volumn 2, Issue 18, 2014, Pages 3542-3548

Enhancement of pressure-free bonding with Cu particles by the addition of Cu-Ni alloy nanoparticles

(2) Watanabe, Ryota a Ishizaki, Toshitaka a

a Rd Management Section (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

LEAD; NANOPARTICLES; NICKEL; SINTERING; SOLDERING ALLOYS;

ADHESIVE STRENGTH; BONDING MATERIALS; BONDING STRENGTH; ENHANCED PROPERTIES; LOW TEMPERATURES; PACKAGING INDUSTRY; PRECISE CONTROL; SURFACE OXIDATIONS;

SYNTHESIS (CHEMICAL);

EID: 84898651832 PISSN: 20507534 EISSN: 20507526 Source Type: Journal
DOI: 10.1039/c4tc00240g Document Type: Article

Times cited : (18)

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