SCOPUS 정보 검색 플랫폼

Volumn 39, Issue 8, 2010, Pages 1233-1240

Carboxylate-passivated silver nanoparticles and their application to sintered interconnection: A replacement for high temperature lead-rich solders

(9) Ogura, Hiroshi a Maruyama, Minoru a Matsubayashi, Ryo b Ogawa, Tetsuya c Nakamura, Shigeyoshi d Komatsu, Teruo a Nagasawa, Hiroshi a Ichimura, Akio a Isoda, Seiji c

a Osaka Prefecture University (Japan)

b Shindengen Electric Manufacturing Co Ltd (Japan)

c KYOTO UNIVERSITY (Japan)

d BRUKER AXS INC (United States)

Author keywords

Carboxylate passivated silver nanoparticles; High temperature lead free solder; Low temperature sintering; Sintered interconnection; Thermal cycling test

Indexed keywords

HIGH TEMPERATURE; LEAD FREE SOLDERS; LOW-TEMPERATURE SINTERING; SILVER NANOPARTICLES; THERMAL CYCLING TEST;

CARBOXYLATION; DIODES; ELECTRIC PROPERTIES; LEAD; NANOPARTICLES; ORGANIC POLYMERS; PASSIVATION; SEMICONDUCTING SILICON COMPOUNDS; SINTERING; SOLDERING ALLOYS; THERMAL CYCLING; THERMODYNAMIC PROPERTIES;

SILVER;

EID: 77954621175 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-010-1236-y Document Type: Article

Times cited : (73)

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