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Volumn 97, Issue 15, 2010, Pages

Low temperature sintering of Ag nanoparticles for flexible electronics packaging

Author keywords

[No Author keywords available]

Indexed keywords

AG NANOPARTICLE; CU WIRES; LOW-TEMPERATURE SINTERING; METALLIC BONDING; MONTE CARLO SIMULATION; NECK GROWTH; OPERATING TEMPERATURE; SOLID STATE SINTERING;

EID: 77958105724     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3502604     Document Type: Article
Times cited : (301)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.