Bonding technique using micro-scaled silver-oxide particles for in-situ formation of silver nanoparticles

Materials Transactions

Volumn 49, Issue 12, 2008, Pages 2875-2880

  Morita, Toshiaki ^a   Yasuda, Yusuke ^a   Ide, Eiichi ^a   Akada, Yusuke ^b   Hirose, Akio ^b  

^a HITACHI LTD   (Japan)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

Bonding technique; Epitaxial growth; Nanoparticle; Reduction; Silver oxide

Indexed keywords

BONDING TECHNIQUE; IN-SITU; NANOPARTICLE; OXIDE PARTICLES; REDUCTION; SEMICONDUCTOR MODULES; SILVER NANOPARTICLES (NPS); SILVER OXIDE; SILVER PARTICLES; TEMPERATURE SINTERING;

EPITAXIAL GROWTH; GROWTH (MATERIALS); MOLECULAR BEAM EPITAXY; NANOPARTICLES; ORGANIC POLYMERS; OXIDES; SEMICONDUCTOR GROWTH; SILVER COMPOUNDS; SINTERING;

SILVER;

EID: 58649100644     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.MRA2008269     Document Type: Article

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