Mechanical properties of nano-silver joints as die attach materials

Journal of Alloys and Compounds

Volumn 514, Issue , 2012, Pages 6-19

  Siow, Kim S ^a  

^a Package Innovation Development Centre   (Malaysia)

Author keywords

Ag nanoparticles; Lead free die attach; Mechanical properties; Sintering

Indexed keywords

AG NANOPARTICLE; BONDING MATERIALS; DIE-ATTACH MATERIALS; LEAD-FREE; MICROELECTRONIC PACKAGING; MICRON SCALE; NANO POWDERS; NANO SCALE; NANO SILVER; PROCESSING CONDITION; PRODUCT APPLICATIONS; THERMAL FATIGUE PROPERTIES;

MATERIALS PROPERTIES; MECHANICAL PROPERTIES; MICROELECTRONICS; NANOPARTICLES; NANOTECHNOLOGY; PACKAGING MATERIALS; SINTERING; TENSILE STRENGTH;

SILVER;

EID: 84455208101     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2011.10.092     Document Type: Review

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