Twin-induced ultra-high thermal conductivity of sintering Ag nanoparticles for high power density electronic packaging

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2014, Pages 163-166

  Wang, Shuai ^a   Li, Mingyu ^a   Kim, Jongmyung ^b  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b Jeonnam Provincial College   (South Korea)

Author keywords

Ag nanoparticle; bonding; sintering; thermal conductivity; twinning

Indexed keywords

BONDING; COHERENT SCATTERING; ELECTRONICS PACKAGING; GRAIN BOUNDARIES; METAL NANOPARTICLES; SILVER NANOPARTICLES; SINTERING; TEMPERATURE; TWINNING;

AG NANOPARTICLE; GRAIN BOUNDARY SCATTERING; HIGH-POWER DENSITY ELECTRONICS; INTRINSIC DEFECTS; LOW-TEMPERATURE SINTERING; NANOSIZED GRAINS; ORGANIC SHELLS; PROTECTING LAYER;

THERMAL CONDUCTIVITY;

EID: 84908092445     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2014.6922628     Document Type: Conference Paper

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